Systems and methods for monitoring junction temperature of a semiconductor switch

    公开(公告)号:US10955297B2

    公开(公告)日:2021-03-23

    申请号:US16002769

    申请日:2018-06-07

    Abstract: A system for monitoring a junction temperature of a semiconductor device includes a sensing resistor electrically coupled to a source terminal of the semiconductor device in a gate loop of the semiconductor device. The system includes a detection circuit electrically coupled to the gate loop of the semiconductor device and configured to measure a voltage difference across the sensing resistor. The system also includes an electronic control unit electrically coupled to the gate loop and the detection circuit. The electronic control unit is configured to determine a first gate current peak during a switching process of the semiconductor device, wherein the first gate current peak is determined based on the voltage detected by the detection circuit. The electronic control unit is configured to determine the junction temperature based on the first gate current peak.

    Liquid driven thermal module and thermal management system

    公开(公告)号:US10746084B2

    公开(公告)日:2020-08-18

    申请号:US16218477

    申请日:2018-12-13

    Abstract: At least one thermal module in fluidic communication with the one or more electronic components. The thermal module including a hydraulic motor operable to rotate a motor output shaft. The module further including a fan coupled to the motor output shaft, at least one heat exchanger in fluidic communication with the fan to provide passage therethrough of an air stream in response to rotational movement of the fan, and a conduit carrying a pressurized liquid stream through the hydraulic motor and each of the at least one heat exchanger. The pressurized liquid stream causing the motor output shaft to rotate and wherein heat in one of the air stream or the pressurized liquid stream is passed through each of the at least one heat exchanger and rejected into the other of the air stream or the pressurized liquid stream. A thermal management system including the at least one thermal module is disclosed.

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