TECHNIQUES FOR PLASMA PROCESSING A SUBSTRATE
    1.
    发明申请
    TECHNIQUES FOR PLASMA PROCESSING A SUBSTRATE 有权
    等离子体处理基板的技术

    公开(公告)号:US20110309049A1

    公开(公告)日:2011-12-22

    申请号:US13157005

    申请日:2011-06-09

    摘要: Techniques for plasma processing a substrate are disclosed. In one particular exemplary embodiment, the technique may be realized with a method comprising introducing a feed gas proximate to a plasma source, where the feed gas may comprise a first and second species, where the first and second species have different ionization energies; providing a multi-level RF power waveform to the plasma source, where the multi-level RF power waveform has at least a first power level during a first pulse duration and a second power level during a second pulse duration, where the second power level may be different from the first power level; ionizing the first species of the feed gas during the first pulse duration; ionizing the second species during the second pulse duration; and providing a bias to the substrate during the first pulse duration.

    摘要翻译: 公开了用于等离子体处理衬底的技术。 在一个特定的示例性实施例中,可以通过包括将进料气体接近等离子体源的方法来实现,其中进料气体可以包括第一和第二物质,其中第一和第二物质具有不同的电离能; 向所述等离子体源提供多级RF功率波形,其中所述多级RF功率波形在第一脉冲持续时间期间具有至少第一功率电平以及在第二脉冲持续时间期间具有第二功率电平,其中所述第二功率电平可以 与第一功率水平不同; 在第一脉冲持续期间电离原料气体的第一种; 在第二脉冲期间电离第二物种; 以及在所述第一脉冲持续时间期间向所述衬底提供偏置。