公开(公告)号：US20160013075A1

公开(公告)日：2016-01-14

申请号：US13618509

申请日：2012-09-14

申请人： Geraldine Tsui Yee LIN ,  Walter de MUNNIK ,  Kin Pui KWAN ,  Wing Him LAU ,  Kwok Cheung TSANG ,  Chun Ho FAN ,  Neil McLELLAN

发明人： Geraldine Tsui Yee LIN ,  Walter de MUNNIK ,  Kin Pui KWAN ,  Wing Him LAU ,  Kwok Cheung TSANG ,  Chun Ho FAN ,  Neil McLELLAN

IPC分类号： H01L21/56 ,  H01L21/78

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

摘要翻译： 一种用于制造集成电路封装的工艺包括选择性地蚀刻引线框条以限定管芯附接焊盘和多个接触焊盘。 管芯附接垫的至少一侧具有多个间隔开的垫部分。 将半导体管芯安装到管芯附接焊盘，并且将导线从半导体管芯接合到相应的接触焊盘。 包括半导体管芯和引线接合的引线框条的第一表面被封装在模制材料中，使得引线框带的至少一个表面被暴露。 集成电路封装从引线框条的其余部分分离。