公开(公告)号：US08330270B1

公开(公告)日：2012-12-11

申请号：US11008593

申请日：2004-12-09

申请人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L23/495 ,  H01L23/04 ,  H01L23/34

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit package having a selectively etched leadframe strip defining a die attach pad and a plurality of contact pads, at least one side of the die attach pad having a plurality of spaced apart pad portions; a semiconductor die mounted to the die attach pad and wires bonding the semiconductor die to respective ones of the contact pads; a first surface of the leadframe strip, including the semiconductor die and wire bonds, encapsulated in a molding material such that at least one surface of the leadframe strip is exposed, and wherein solder paste is disposed on said contact pads and said at least one side of said die attach pad.

摘要翻译： 一种集成电路封装，其具有限定管芯附接焊盘和多个接触焊盘的选择性蚀刻的引线框条，所述管芯附接焊盘的至少一侧具有多个间隔开的焊盘部分; 安装到管芯附接焊盘的半导体管芯和将半导体管芯接合到相应的接触焊盘的引线; 引线框带的第一表面，包括半导体管芯和引线接合，封装在模制材料中，使得引线框架条的至少一个表面被暴露，并且其中焊膏设置在所述接触焊盘和所述至少一个侧面上 的所述管芯附接垫。

公开(公告)号：US09520306B2

公开(公告)日：2016-12-13

申请号：US13618509

申请日：2012-09-14

申请人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

发明人： Geraldine Tsui Yee Lin ,  Walter de Munnik ,  Kin Pui Kwan ,  Wing Him Lau ,  Kwok Cheung Tsang ,  Chun Ho Fan ,  Neil McLellan

IPC分类号： H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/78

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

摘要翻译： 一种用于制造集成电路封装的工艺包括选择性地蚀刻引线框条以限定管芯附接焊盘和多个接触焊盘。 管芯附接垫的至少一侧具有多个间隔开的垫部分。 将半导体管芯安装到管芯附接焊盘，并且将导线从半导体管芯接合到相应的接触焊盘。 包括半导体管芯和引线接合的引线框条的第一表面被封装在模制材料中，使得引线框带的至少一个表面被暴露。 集成电路封装从引线框条的其余部分分离。