Method for removing structures
    1.
    发明授权
    Method for removing structures 失效
    去除结构的方法

    公开(公告)号:US06825116B2

    公开(公告)日:2004-11-30

    申请号:US09845405

    申请日:2001-04-30

    IPC分类号: H01L21302

    摘要: A method for removing structures from a substrate is described. The method includes providing a substrate that has the structures that must be removed, applying a sacrifice layer, and removing the structures and the sacrifice layer in a polishing step. The method has the advantage that the sacrifice layer surrounds the structures that must be removed and stabilizes them, so that the structures can be eroded slowly and successively in the subsequent polishing step without breaking off. This prevents a smearing of the material of the structures such as occurs given direct polishing without a sacrifice layer.

    摘要翻译: 描述了从衬底去除结构的方法。 该方法包括提供具有必须去除的结构的基底,施加牺牲层,以及在抛光步骤中去除结构和牺牲层。 该方法的优点在于,牺牲层围绕必须被去除和稳定的结构,从而可以在随后的抛光步骤中缓慢且连续地腐蚀结构而不会断裂。 这样可以防止结构材料的污染,例如直接抛光而没有牺牲层。