MATERIAL COMPONENTS PROTECTION AGAINST THE CORROSIVE ACTION CRYOLITE MELTS IN ALUMINIUM REDUCTION CELLS

    公开(公告)号:US20230021762A1

    公开(公告)日:2023-01-26

    申请号:US17961021

    申请日:2022-10-06

    Inventor: Claude Allaire

    Abstract: The present document describes an electrolytic cell comprising a protective layer comprising elemental copper covering at least in part or all of a refractory material assembly covering an interior surface thereof. Also described is a copper oxide containing composition comprising copper oxide and any one of a reducing agent and a binder. Also described is a method of protecting a refractory material assembly covering an interior surface of an electrolytic cell, comprising covering at least in part, or all of the refractory material assembly with a copper sheet, a structure comprising elemental copper, a copper oxide, an elemental copper comprising composite material, a copper oxide containing composition and combinations thereof, to provide a protective layer comprising elemental copper.

    Material components protection against the corrosive action cryolite melts in aluminium reduction cells

    公开(公告)号:US11891711B2

    公开(公告)日:2024-02-06

    申请号:US17961021

    申请日:2022-10-06

    Inventor: Claude Allaire

    CPC classification number: C25C3/08 C25C3/125

    Abstract: The present document describes an electrolytic cell comprising a protective layer comprising elemental copper covering at least in part or all of a refractory material assembly covering an interior surface thereof. Also described is a copper oxide containing composition comprising copper oxide and any one of a reducing agent and a binder. Also described is a method of protecting a refractory material assembly covering an interior surface of an electrolytic cell, comprising covering at least in part, or all of the refractory material assembly with a copper sheet, a structure comprising elemental copper, a copper oxide, an elemental copper comprising composite material, a copper oxide containing composition and combinations thereof, to provide a protective layer comprising elemental copper.

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