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公开(公告)号：US07350290B2
公开(公告)日：2008-04-01
申请号：US10987246
申请日：2004-11-12
IPC分类号： H05K13/04
CPC分类号： G01R1/0483 , H01R2201/20 , Y10T29/5313 , Y10T29/53183 , Y10T29/53213 , Y10T29/53283
摘要： A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.
摘要翻译： 压缩装置具有尺寸适于接纳集成电路封装和加压件的框架。 框架包括限定具有轴线的开口的表面和从表面延伸的至少一个斜面。 斜坡或斜坡具有大致平行于垂直于该轴线的平面的上部平坦部分和下部平坦部分，以及连接上部和下部平坦部分的倾斜部分，该部分与该平面成一定角度。 加压件构造成接合斜坡并响应于施加的力旋转。 当加压件与斜面的倾斜部分接合时，该旋转引起加压件沿轴线的移动。 然而，当斜面和加压件之间的接合处于斜面的平坦部分中时，加压件沿轴线的继续移动受到限制，尽管有任何持续的旋转。
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公开(公告)号：US07021945B2
公开(公告)日：2006-04-04
申请号：US10820296
申请日：2004-04-08
IPC分类号： H01R12/00
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
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公开(公告)号：US08109770B2
公开(公告)日：2012-02-07
申请号：US11397334
申请日：2006-04-04
IPC分类号： H01R12/00
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
摘要翻译： 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件，所述互耦部件可以包括由电绝缘材料形成并具有上表面和下表面的部分，所述部分包括 多个孔设置在其上表面上并且以预定的占地面积布置，一个或多个屏蔽构件，由导电材料形成，该屏蔽构件设置在该段内并被构造成连接到该系统的底盘接地电路，以及由导电材料形成的框架 并配置为与系统的机箱接地电路连接。 相互耦合组件可以包括被分组成被配置为传输单端或差分信号的多接点组的导电触点阵列。 互耦分量可以包括位于信号触点之间的空腔，以调节信号触点之间的差分阻抗。
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公开(公告)号：US06899550B2
公开(公告)日：2005-05-31
申请号：US10786248
申请日：2004-02-25
IPC分类号： H01R13/648 , H05K9/00 , H01R12/00
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.
摘要翻译： 用于接收触点阵列的相互耦合部件包括具有设置在其上表面上的多个孔并且以对应于触点阵列的预定尺寸布置的非导电衬底。 触点设置在孔内，并且可以对空气开放或填充有一些其它介电材料的空腔设置在相邻触点之间的基板中。
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公开(公告)号：US06743049B2
公开(公告)日：2004-06-01
申请号：US10178957
申请日：2002-06-24
IPC分类号： H01R13648
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component may include a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint, one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system and a frame formed of electrically conductive material and configured to connect with the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts grouped to multi-contact groupings configured to transmit single-ended or differential signals. The intercoupling component may include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
摘要翻译： 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件，所述互耦部件可以包括由电绝缘材料形成并具有上表面和下表面的部分，所述部分包括 多个孔设置在其上表面上并且以预定的占地面积布置，一个或多个屏蔽构件，由导电材料形成，该屏蔽构件设置在该段内并被构造成连接到该系统的底盘接地电路，以及由导电材料形成的框架 并配置为与系统的机箱接地电路连接。 相互耦合组件可以包括被分组成被配置为传输单端或差分信号的多接点组的导电触点阵列。 互耦分量可以包括位于信号触点之间的空腔，以调节信号触点之间的差分阻抗。
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公开(公告)号：US07220134B2
公开(公告)日：2007-05-22
申请号：US11065015
申请日：2005-02-24
IPC分类号： H01R12/00
CPC分类号： H01R13/2421 , H05K7/1061
摘要： A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end defining a first open cavity; a pin including an end defining a second open cavity; and a coiled spring interposed between the socket shell and the pin, the spring including a first end section received within the first open cavity and a second end section received within the second open cavity.
摘要翻译： 插座端子组件被配置为将集成电路的接触区域与衬底的相应连接区域电连接，插座端子组件包括插座壳体，该插座壳体包括构造成接触衬底的相应连接区域的第一端和第二端 端部限定第一开放空腔; 销，包括限定第二开放空腔的端部; 以及设置在所述插座外壳和所述销之间的螺旋弹簧，所述弹簧包括容纳在所述第一敞开空腔内的第一端部部分和容纳在所述第二敞开空腔内的第二端部部分。
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