公开(公告)号：US20230236361A1

公开(公告)日：2023-07-27

申请号：US17649191

申请日：2022-01-27

Applicant: GlobalFoundries U.S. Inc.

Inventor： HEMANT MARTAND DIXIT ,  WILLIAM J. TAYLOR, JR. ,  YUSHENG BIAN ,  THEODORE LETAVIC ,  OSCAR D. RESTREPO

IPC: G02B6/125

CPC classification number: G02B6/125

Abstract: The disclosed subject matter relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to photonic devices having thermally conductive layers for the removal of heat from optoelectronic components in the photonic devices.