-
公开(公告)号:US20250126888A1
公开(公告)日:2025-04-17
申请号:US18453507
申请日:2023-08-22
Applicant: GlobalFoundries U.S. Inc.
Inventor: George Robert Mulfinger , Pushparaj Pathak , Selina A. Mala
Abstract: A semiconductor device includes an insulating layer, a first semiconductor layer over the insulating layer, a diffusion break structure between a first active region and a second active region and including a first insulating pattern over the insulating layer and an opening over the first insulating pattern, and a conductive gate material over the opening.