公开(公告)号：US09399596B1

公开(公告)日：2016-07-26

申请号：US14105257

申请日：2013-12-13

Applicant: Google Inc.

Inventor： Hongqin Shi ,  Sandeep Giri ,  Amir Torkaman ,  Jamie Nam

IPC: H01L21/00 ,  H01L25/00 ,  C03C27/10

CPC classification number: C03C27/10 ,  B32B17/06 ,  G02B27/00 ,  G02B27/017 ,  G02B2027/0178 ,  H01L25/00

Abstract: The present disclosure provides methods and systems for bonding multiple wafers. An example system may include a sealable chamber with a first and second substantially vertical post positioned inside of the sealable chamber. The system may also include a first latch connected to the first post via a first pin, wherein the first pin allows the first latch to rotate about the first pin. The system may also include a second latch similarly configured to the first latch. The system may also include a base plate positioned between the first and second posts. The base plate is arranged such that when a first wafer rests on the base plate and a second wafer rests on the first and second latches, moving the base plate from a first position to a second position causes a top surface of the first wafer to contact a bottom surface of the second wafer.

Abstract translation: 本公开提供了用于粘合多个晶片的方法和系统。 示例性系统可以包括可密封腔室，其具有位于可密封腔室内部的第一和第二基本垂直的杆。 系统还可以包括经由第一销连接到第一柱的第一闩锁，其中第一销允许第一闩锁围绕第一销旋转。 该系统还可以包括类似地配置到第一锁存器的第二锁存器。 该系统还可以包括位于第一和第二柱之间的基板。 基板布置成使得当第一晶片搁置在基板上并且第二晶片搁置在第一和第二闩锁上时，将基板从第一位置移动到第二位置使得第一晶片的顶表面接触 第二晶片的底表面。