公开(公告)号：US20170171370A1

公开(公告)日：2017-06-15

申请号：US15443208

申请日：2017-02-27

Applicant: Google Inc.

Inventor： Paul Eremenko ,  David Fishman ,  Jason Chua ,  Andrew Viny

IPC: H04M1/02 ,  H04W8/24 ,  H04B5/00

CPC classification number: H04M1/0254 ,  H04B5/0062 ,  H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0266 ,  H04W8/24

Abstract: A system for tangible configuration of a modular mobile electronic device includes a set of emulator modules, each comprising a processor and configurable to represent any of a set of full modules available for use with the modular mobile electronic device a chassis that mechanically couples to at least one of the set of emulator modules, and a module configurator that associates each of the set of emulator modules with an emulation profile.

公开(公告)号：US09614942B2

公开(公告)日：2017-04-04

申请号：US14834258

申请日：2015-08-24

Applicant: Google Inc.

Inventor： Paul Eremenko ,  David Fishman ,  Jason Chua ,  Andrew Viny

IPC: H04M1/02

CPC classification number: H04M1/0254 ,  H04B5/0062 ,  H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0266 ,  H04W8/24

Abstract: A system for tangible configuration of a modular mobile electronic device includes a set of emulator modules, each comprising a processor and configurable to represent any of a set of full modules available for use with the modular mobile electronic device a chassis that mechanically couples to at least one of the set of emulator modules, and a module configurator that associates each of the set of emulator modules with an emulation profile.

公开(公告)号：US09838516B2

公开(公告)日：2017-12-05

申请号：US15443208

申请日：2017-02-27

Applicant: Google Inc.

Inventor： Paul Eremenko ,  David Fishman ,  Jason Chua ,  Andrew Viny

IPC: H04M1/02 ,  H04B5/00 ,  H04W8/24

CPC classification number: H04M1/0254 ,  H04B5/0062 ,  H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0266 ,  H04W8/24

Abstract: A system for tangible configuration of a modular mobile electronic device includes a set of emulator modules, each comprising a processor and configurable to represent any of a set of full modules available for use with the modular mobile electronic device a chassis that mechanically couples to at least one of the set of emulator modules, and a module configurator that associates each of the set of emulator modules with an emulation profile.

公开(公告)号：US20160057259A1

公开(公告)日：2016-02-25

申请号：US14834258

申请日：2015-08-24

Applicant: Google, Inc.

Inventor： Paul Eremenko ,  David Fishman ,  Jason Chua ,  Andrew Viny

IPC: H04M1/02

CPC classification number: H04M1/0254 ,  H04B5/0062 ,  H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0266 ,  H04W8/24

Abstract: A system for tangible configuration of a modular mobile electronic device includes a set of emulator modules, each comprising a processor and configurable to represent any of a set of full modules available for use with the modular mobile electronic device a chassis that mechanically couples to at least one of the set of emulator modules, and a module configurator that associates each of the set of emulator modules with an emulation profile.

Abstract translation: 用于模块化移动电子设备的有形配置的系统包括一组仿真器模块，每个仿真器模块包括处理器，并且可配置为表示可与模块化移动电子设备一起使用的一组完整模块中的任何一个，机箱至少机械耦合 仿真器模块集合中的一个，以及将仿真器模块中的每一个与仿真配置文件相关联的模块配置器。