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    SYSTEMS FOR MODULE AND MODULAR MOBILE ELECTRONIC DEVICE TESTING
    3.
    发明申请
    SYSTEMS FOR MODULE AND MODULAR MOBILE ELECTRONIC DEVICE TESTING 审中-公开
    用于模块和模块化移动电子设备测试的系统

    公开(公告)号：US20160056902A1

    公开(公告)日：2016-02-25

    申请号：US14834227

    申请日：2015-08-24

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober

    IPC: H04B17/00 ,  H04M1/02

    CPC classification number: H04B17/16 ,  H04M1/24 ,  H04M1/72569

    Abstract: A system for module testing includes a module interface that includes a power interface, a data interface, and a mechanical interface; a functional testing system that simulates at least one of power conditions and data conditions for the module; and a model generator, wherein the module generator generates models of a modular mobile electronic device based on module operations data.

    Abstract translation: 用于模块测试的系统包括模块接口，其包括电源接口，数据接口和机械接口; 功能测试系统，模拟模块的功率条件和数据条件中的至少一个; 以及模型发生器，其中所述模块发生器基于模块操作数据生成模块化移动电子设备的模型。

    SYSTEMS FOR MODULE INTERFACING OF MODULAR MOBILE ELECTRONIC DEVICES
    4.
    发明申请
    SYSTEMS FOR MODULE INTERFACING OF MODULAR MOBILE ELECTRONIC DEVICES 有权
    用于模块化移动电子设备的模块接口的系统

    公开(公告)号：US20160056587A1

    公开(公告)日：2016-02-25

    申请号：US14834199

    申请日：2015-08-24

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Boyan Kurtovich ,  Shahriar Khushrushahi ,  Gadi Amit ,  Inbal Etgar ,  Dan Clifton

    IPC: H01R13/66 ,  H01R24/60

    CPC classification number: H01R13/665 ,  H01R13/6205 ,  H01R13/629 ,  H01R24/60 ,  H04B5/0012 ,  H04B5/0037

    Abstract: A module interface of a modular electronic device includes a data interface, coupled to a module communication network of the modular electronic device, that enables data transfer between the module communication network and modules coupled to the data interface; a power interface, coupled to a module power network of the modular electronic device, that enables power transfer between the module power network and modules coupled to the power interface; and a mechanical interface, coupled to a chassis of the modular mobile electronic device, that enables modules to be removably and mechanically coupled to the modular electronic device.

    Abstract translation: 模块化电子设备的模块接口包括耦合到模块化电子设备的模块通信网络的数据接口，其实现模块通信网络与耦合到数据接口的模块之间的数据传输; 耦合到模块化电子设备的模块电力网络的电源接口，其实现模块电力网络和耦合到电力接口的模块之间的功率传输; 以及耦合到所述模块化移动电子设备的机架的机械接口，其使得模块能够可移除地和机械地耦合到所述模块化电子设备。

    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device
    5.
    发明授权
    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device 有权

    公开(公告)号：US10042402B2

    公开(公告)日：2018-08-07

    申请号：US14680955

    申请日：2015-04-07

    Applicant: Google Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober

    IPC: G06F1/20

    Abstract: Systems and methods for thermal management of a mobile electronic device. During operation of a modular mobile electronic device that is coupled to one or more modules via respective module interfaces of the electronic device, a thermal controller of the electronic device is used to update at least one system thermal goal based on a change for a module thermal model for at least one module coupled to the electronic device. A determination is made as to whether the updated at least one system thermal goal is satisfied based on thermal data provided by a plurality of thermal sensors arranged at locations associated with the electronic device. Responsive to a determination that the updated at least one system thermal goal is not satisfied, the thermal controller controls heat transfer to satisfy the updated at least one thermal goal.

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