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    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device
    1.
    发明授权
    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device 有权

    公开(公告)号：US10042402B2

    公开(公告)日：2018-08-07

    申请号：US14680955

    申请日：2015-04-07

    Applicant: Google Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober

    IPC: G06F1/20

    Abstract: Systems and methods for thermal management of a mobile electronic device. During operation of a modular mobile electronic device that is coupled to one or more modules via respective module interfaces of the electronic device, a thermal controller of the electronic device is used to update at least one system thermal goal based on a change for a module thermal model for at least one module coupled to the electronic device. A determination is made as to whether the updated at least one system thermal goal is satisfied based on thermal data provided by a plurality of thermal sensors arranged at locations associated with the electronic device. Responsive to a determination that the updated at least one system thermal goal is not satisfied, the thermal controller controls heat transfer to satisfy the updated at least one thermal goal.

    Systems and methods for power management of a modular mobile electronic device
    5.
    发明授权
    Systems and methods for power management of a modular mobile electronic device 有权

    公开(公告)号：US09723564B2

    公开(公告)日：2017-08-01

    申请号：US14680944

    申请日：2015-04-07

    Applicant: Google Inc.

    Inventor： David Fishman ,  Seth Newburg ,  Ara Knaian ,  Paul Eremenko

    IPC: H04W52/02 ,  H04M1/725 ,  H04M1/02

    CPC classification number: H04W52/0261 ,  H04M1/0254 ,  H04W52/0222 ,  H04W52/0258 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/166

    Abstract: Systems and methods for power management of a mobile electronic device. During operation of a modular mobile electronic device, module power characteristic data of a plurality of modules coupled to the electronic device is collected. Each module is coupled to the electronic device via a respective module interface of the electronic device. A module power model is updated for at least one module of the plurality of modules based on module power characteristic data collected for the at least one module. A context-aware power budget of the electronic device is updated based on updating of the module power model for the at least one module. Module power flow of the electronic device is adapted based on updates to the context-aware power budget. Adapting module power flow includes adapting allocation of power in real-time to at least one power consumer module coupled the electronic device via a respective module interface.

    SYSTEMS AND METHODS FOR TANGIBLE CONFIGURATION OF A MODULAR MOBILE ELECTRONIC DEVICE
    8.
    发明申请
    SYSTEMS AND METHODS FOR TANGIBLE CONFIGURATION OF A MODULAR MOBILE ELECTRONIC DEVICE 有权
    用于模块化移动电子设备的可变配置的系统和方法

    公开(公告)号：US20160057259A1

    公开(公告)日：2016-02-25

    申请号：US14834258

    申请日：2015-08-24

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Jason Chua ,  Andrew Viny

    IPC: H04M1/02

    CPC classification number: H04M1/0254 ,  H04B5/0062 ,  H04M1/0249 ,  H04M1/0262 ,  H04M1/0264 ,  H04M1/0266 ,  H04W8/24

    Abstract: A system for tangible configuration of a modular mobile electronic device includes a set of emulator modules, each comprising a processor and configurable to represent any of a set of full modules available for use with the modular mobile electronic device a chassis that mechanically couples to at least one of the set of emulator modules, and a module configurator that associates each of the set of emulator modules with an emulation profile.

    Abstract translation: 用于模块化移动电子设备的有形配置的系统包括一组仿真器模块，每个仿真器模块包括处理器，并且可配置为表示可与模块化移动电子设备一起使用的一组完整模块中的任何一个，机箱至少机械耦合 仿真器模块集合中的一个，以及将仿真器模块中的每一个与仿真配置文件相关联的模块配置器。

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