公开(公告)号：US10223531B2

公开(公告)日：2019-03-05

申请号：US15396052

申请日：2016-12-30

Applicant: Google Inc.

Inventor： Marius Schilder ,  Timothy Chen ,  Scott Johnson ,  Harrison Pham ,  Derek Martin

IPC: G06F21/57 ,  G06F21/30 ,  H04L9/08 ,  G01R31/3185 ,  G01R31/317 ,  G06F21/73 ,  G06F21/74 ,  G06F21/75 ,  G06F21/79 ,  G11C7/24 ,  G11C16/22 ,  G11C29/36 ,  G11C29/40 ,  G11C29/46 ,  G11C17/14 ,  G11C17/18 ,  G11C29/04 ,  G11C29/44

Abstract: A semiconductor chip device include device state fuses that may be used to configure various device states and corresponding security levels for the semiconductor chip as it transitions from wafer manufacturing to provisioned device. The device states and security levels prevent the semiconductor chip from being accessed and exploited, for example, during manufacturing testing. A secure boot flow process for a semiconductor chip over its lifecycle is also disclosed. The secure boot flow may start at the wafer manufacturing stage and continue on through the insertion of keys and firmware.