公开(公告)号：US20240114670A1

公开(公告)日：2024-04-04

申请号：US17937953

申请日：2022-10-04

Applicant: Google LLC

Inventor： Wen Shian Lin ,  Chien Hua Hsu ,  Shihwen Lee ,  Bing-Feng Wang ,  Chijer Wang

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K9/0032 ,  H05K9/0037

Abstract: Techniques and apparatuses directed to component shielding are described in this document. A first aspect relates to a system including a printed circuit board (PCB) oriented along a first plane, a device on the PCB, and a component shield having a wall structure oriented perpendicular to the first plane and a cover structure connected to the wall structure. The system includes a housing structure oriented along a second plane that is substantially parallel to the first plane. The first and second planes define a shielded space within which the component shield and the device reside. The system further includes a shielding layer residing at least partially between the cover and housing structures. The shielding layer has an irregular cross-section along a fourth plane perpendicular to at least one of the first or second planes and a third plane. The irregular cross-section includes a protrusion that extends from the third plane.

公开(公告)号：US20250133709A1

公开(公告)日：2025-04-24

申请号：US18999262

申请日：2024-12-23

Applicant: Google LLC

Inventor： Chien Hua Hsu ,  ChanWei Chiu ,  Bing-Feng Wang ,  Shen Hao Lee ,  Jui Hung Hsu ,  Jehyoung Lee

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

Abstract: This document describes a system including a printed circuit board oriented along a first plane, the printed circuit board having a device that extends in a direction away from the first plane and is capable of producing a radiated signal or is sensitive to a radiated signal produced by another device. The system includes a component shield with a wall structure and a cover structure, the cover structure connected to the wall structure. A housing structure oriented along a second plane defines a shielded space within which the component shield and the device reside. A shielding layer oriented along a third plane substantially parallel with the second plane is disposed at least partially between the cover structure and the housing structure and configured to attenuate radiated signals. A number of capacitor spot welds affix the shielding layer to the cover structure to improve component shielding.