公开(公告)号：US20230260950A1

公开(公告)日：2023-08-17

申请号：US18306840

申请日：2023-04-25

Applicant: Google LLC

Inventor： ChanWei Chiu ,  Naiyong Chen ,  Yencheng Chen ,  Guangjun Huang ,  Michael J. Lombardi ,  Nael Hannan

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L25/16 ,  H01L24/73 ,  H01L24/16 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/26175 ,  H01L2924/19041 ,  H01L2224/75611 ,  H01L24/75

Abstract: This document describes apparatuses and techniques for disposing an underfill dam on a device adjacent to a mounting location for an integrated circuit to direct a flow of underfill toward the mounting location so that the underfill does not flow in undesired directions that may undesirably affect adjacent components.

公开(公告)号：US20250133709A1

公开(公告)日：2025-04-24

申请号：US18999262

申请日：2024-12-23

Applicant: Google LLC

Inventor： Chien Hua Hsu ,  ChanWei Chiu ,  Bing-Feng Wang ,  Shen Hao Lee ,  Jui Hung Hsu ,  Jehyoung Lee

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

Abstract: This document describes a system including a printed circuit board oriented along a first plane, the printed circuit board having a device that extends in a direction away from the first plane and is capable of producing a radiated signal or is sensitive to a radiated signal produced by another device. The system includes a component shield with a wall structure and a cover structure, the cover structure connected to the wall structure. A housing structure oriented along a second plane defines a shielded space within which the component shield and the device reside. A shielding layer oriented along a third plane substantially parallel with the second plane is disposed at least partially between the cover structure and the housing structure and configured to attenuate radiated signals. A number of capacitor spot welds affix the shielding layer to the cover structure to improve component shielding.

公开(公告)号：US20230413440A1

公开(公告)日：2023-12-21

申请号：US18462212

申请日：2023-09-06

Applicant: Google LLC

Inventor： Jiali Lai ,  Naiyong Chen ,  ChanWei Chiu ,  Joseph L. Allore ,  Michael J. Lombardi

IPC: H05K1/14 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: Disclosed is a cavity-stacked printed circuit board (PCB) assembly that includes a first PCB formed of glass-reinforced epoxy material and has a first and a second side. The first side includes an open cavity with a cavity floor and at least one side wall that extends between the floor and the first side. The open cavity defines a cavity perimeter, which includes a base defined around the perimeter. The second PCB has a top side opposite a bottom side. The top side has an electrical component around which an interposer region is defined. Solder is disposed between the interposer region of the second PCB and the base of the first PCB to couple the first PCB to the second PCB with the electrical component received in the cavity to form the cavity-stacked PCB assembly.