公开(公告)号：US10785896B2

公开(公告)日：2020-09-22

申请号：US16453669

申请日：2019-06-26

Applicant: Google LLC

Inventor： Eehern J. Wong ,  Pascal Kam ,  Thomas R. Kowalski ,  Ron Drew

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.

公开(公告)号：US20180235108A1

公开(公告)日：2018-08-16

申请号：US15949511

申请日：2018-04-10

Applicant: Google LLC

Inventor： Emad Samadiani ,  Eehern J. Wong ,  Gregory P. Imwalle ,  Soheil Farshchian

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20836

Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

公开(公告)号：US10542641B2

公开(公告)日：2020-01-21

申请号：US15949511

申请日：2018-04-10

Applicant: Google LLC

Inventor： Emad Samadiani ,  Eehern J. Wong ,  Gregory P. Imwalle ,  Soheil Farshchian

IPC: H05K7/20 ,  G06F1/20

Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

公开(公告)号：US10342163B2

公开(公告)日：2019-07-02

申请号：US14956595

申请日：2015-12-02

Applicant: Google LLC

Inventor： Eehern J. Wong ,  Pascal Kam ,  Thomas R. Kowalski ,  Ron Drew

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.

公开(公告)号：US09961803B2

公开(公告)日：2018-05-01

申请号：US15359154

申请日：2016-11-22

Applicant: Google LLC

Inventor： Emad Samadiani ,  Eehern J. Wong ,  Gregory P. Imwalle ,  Soheil Farshchian

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/20836

Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.

公开(公告)号：US20190320558A1

公开(公告)日：2019-10-17

申请号：US16453669

申请日：2019-06-26

Applicant: Google LLC

Inventor： Eehern J. Wong ,  Pascal Kam ,  Thomas R. Kowalski ,  Ron Drew

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.