公开(公告)号：US20230260950A1

公开(公告)日：2023-08-17

申请号：US18306840

申请日：2023-04-25

Applicant: Google LLC

Inventor： ChanWei Chiu ,  Naiyong Chen ,  Yencheng Chen ,  Guangjun Huang ,  Michael J. Lombardi ,  Nael Hannan

IPC: H01L23/00 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L25/16 ,  H01L24/73 ,  H01L24/16 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/26175 ,  H01L2924/19041 ,  H01L2224/75611 ,  H01L24/75

Abstract: This document describes apparatuses and techniques for disposing an underfill dam on a device adjacent to a mounting location for an integrated circuit to direct a flow of underfill toward the mounting location so that the underfill does not flow in undesired directions that may undesirably affect adjacent components.