公开(公告)号：US20200323098A1

公开(公告)日：2020-10-08

申请号：US16904763

申请日：2020-06-18

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

公开(公告)号：US20190104636A1

公开(公告)日：2019-04-04

申请号：US15724923

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/14 ,  H05K7/20

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US11357135B2

公开(公告)日：2022-06-07

申请号：US17026978

申请日：2020-09-21

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US11477908B2

公开(公告)日：2022-10-18

申请号：US16904763

申请日：2020-06-18

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

公开(公告)号：US10709034B2

公开(公告)日：2020-07-07

申请号：US15901058

申请日：2018-02-21

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: A data center rack system includes a rack housing that includes side panels and a top panel coupled to the side panels, the top and side panels defining a rack volume sized to enclose a plurality of data center server rack trays, each of the data center server rack trays configured to support a plurality of heat generating electronic devices; and a rack bottom coupled to the side panels to at least partially define the rack volume, the rack bottom including a bottom panel having a top surface coupled to the side panels and a plurality of blocks coupled to a bottom surface of the bottom panel opposite the top surface, at least one pair of the plurality of blocks defining an opening between the blocks and below the bottom surface of the bottom panel and sized to receive a lifting member of a lifting machine.

公开(公告)号：US20190037729A1

公开(公告)日：2019-01-31

申请号：US16150842

申请日：2018-10-03

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

公开(公告)号：US20210112676A1

公开(公告)日：2021-04-15

申请号：US17115198

申请日：2020-12-08

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

公开(公告)号：US10785895B2

公开(公告)日：2020-09-22

申请号：US15724923

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US20190104637A1

公开(公告)日：2019-04-04

申请号：US15724967

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

公开(公告)号：US11297736B2

公开(公告)日：2022-04-05

申请号：US17117674

申请日：2020-12-10

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.