公开(公告)号：US20210112676A1

公开(公告)日：2021-04-15

申请号：US17115198

申请日：2020-12-08

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

公开(公告)号：US10785895B2

公开(公告)日：2020-09-22

申请号：US15724923

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US20190104637A1

公开(公告)日：2019-04-04

申请号：US15724967

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung

IPC: H05K7/14 ,  H05K7/20

Abstract: Techniques for managing data center electronic devices in a data center include operating data center server devices that define a particular amount of computing power of a data center, the devices supported in server racks positioned in a frame assembly that includes bays defined along a lengthwise dimension of the frame assembly, the bays arranged in stacked layers that include at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays, the server racks positioned in at least one of the bays of the first or second layers of bays; determining that at least one of the server devices requires a maintenance operation; based on the determination, operating an automated service machine to move to a location in the data center that is adjacent to the data center server device; and performing the maintenance operation on the at least one data center server device with the automated service machine.

公开(公告)号：US11357135B2

公开(公告)日：2022-06-07

申请号：US17026978

申请日：2020-09-21

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US10344766B2

公开(公告)日：2019-07-09

申请号：US16020657

申请日：2018-06-27

Applicant: Google LLC

Inventor： Kenneth Dale Shaul ,  Soheil Farshchian ,  Roy Michael Bannon ,  Angela Chen ,  Jonathan D. Beck

IPC: H05K7/20 ,  F04D25/16 ,  G06F1/20 ,  F04D29/58 ,  F04D25/00 ,  H05K7/00

Abstract: Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.

公开(公告)号：US20190104636A1

公开(公告)日：2019-04-04

申请号：US15724923

申请日：2017-10-04

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Michael Chi Kin Lau ,  Bill Dailey ,  Angela Chen ,  Winnie Leung ,  Peter Pellerzi ,  Soheil Farshchian

IPC: H05K7/14 ,  H05K7/20

Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.

公开(公告)号：US10218538B1

公开(公告)日：2019-02-26

申请号：US14168245

申请日：2014-01-30

Applicant: Google LLC

Inventor： Peter Michael Klausler ,  Angela Chen ,  Michael Roger Marty ,  Philip Michael Wells ,  Adi Avidor

IPC: H04L12/64 ,  H04L12/24

Abstract: The expansion of a network by converting the network from a 2-stage folded Clos network to a 3-stage folded Clos network can be cost prohibitive. The system and methods described herein relate to a hybrid network topology. More particularly, the disclosure describes a hybrid topology having internal switches configured in a multidimensional topology configuration. Each of the internal switches are connected to the network hosts with a folded Clos topology.

公开(公告)号：US20190037729A1

公开(公告)日：2019-01-31

申请号：US16150842

申请日：2018-10-03

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

公开(公告)号：US11297736B2

公开(公告)日：2022-04-05

申请号：US17117674

申请日：2020-12-10

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.

公开(公告)号：US20210100136A1

公开(公告)日：2021-04-01

申请号：US17117674

申请日：2020-12-10

Applicant: Google LLC

Inventor： Jayson Michael Jochim ,  Angela Chen ,  Soheil Farshchian ,  Winnie Leung ,  Michael Chi Kin Lau

IPC: H05K7/20 ,  H05K7/14

Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.