公开(公告)号：US11791239B2

公开(公告)日：2023-10-17

申请号：US17202552

申请日：2021-03-16

Applicant: Google LLC

Inventor： Sue Yun Teng

IPC: H01L23/467 ,  H01L23/498

CPC classification number: H01L23/467 ,  H01L23/49816

Abstract: The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate, a metal plate, and/or a package pedestal. The backer plate may include one or more air inlet ports configured to be connected to an air compressor. Air inlet ducts may extend from the air inlet ports through at least a portion of the backer plate. A plurality of vents may extend from the air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first BGA. The cooling gas may maintain the solder joint temperature of the first BGA package below the reflow temperature and below the solidus temperature of the solder joints to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.

公开(公告)号：US11756851B2

公开(公告)日：2023-09-12

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015 ,  H05K7/10

CPC classification number: H01L23/32 ,  H02B1/015 ,  H05K7/1007

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US12243804B1

公开(公告)日：2025-03-04

申请号：US18239361

申请日：2023-08-29

Applicant: Google LLC

Inventor： Sue Yun Teng

IPC: H01L23/467 ,  H01L23/498

Abstract: The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate and a metal plate. A plurality of vents may extend from air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first ball grid array (BGA) package. The cooling gas may maintain the solder joint temperature of the first BGA package below a reflow temperature and below a solidus temperature to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.

公开(公告)号：US20220077020A1

公开(公告)日：2022-03-10

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US11791231B2

公开(公告)日：2023-10-17

申请号：US17525275

申请日：2021-11-12

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015 ,  H05K7/10

CPC classification number: H01L23/32 ,  H02B1/015 ,  H05K7/1007

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US11183438B1

公开(公告)日：2021-11-23

申请号：US16874194

申请日：2020-05-14

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01L23/32 ,  H02B1/015

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.

公开(公告)号：US20240055317A1

公开(公告)日：2024-02-15

申请号：US17885022

申请日：2022-08-10

Applicant: Google LLC

Inventor： Emad Samadiani ,  Padam Jain ,  Yingshi Tang ,  Sue Yun Teng ,  Nicholas Chao Wei Wong ,  Kieran Miller ,  Sudharshan Sugavanesh Udhayakumar

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/3677 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/0401

Abstract: A compliant pad spacer utilized in a three-dimensional IC packaging is provided. The compliant pad spacer may be utilized to provide adequate support among the substrates or boards, such as packing substrates, interposers or print circuit broads (PCBs), so as to minimize the effects of substrate warpage or structural collapse in the IC packaging. In one example, the compliant pad spacer includes an insulating material, such as silicon-based polymer composites having ceramic fillers disposed therein.

公开(公告)号：US20220301977A1

公开(公告)日：2022-09-22

申请号：US17202552

申请日：2021-03-16

Applicant: Google LLC

Inventor： Sue Yun Teng

IPC: H01L23/467 ,  H01L23/498

Abstract: The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate, a metal plate, and/or a package pedestal. The backer plate may include one or more air inlet ports configured to be connected to an air compressor. Air inlet ducts may extend from the air inlet ports through at least a portion of the backer plate. A plurality of vents may extend from the air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first BGA. The cooling gas may maintain the solder joint temperature of the first BGA package below the reflow temperature and below the solidus temperature of the solder joints to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.

公开(公告)号：US20210359448A1

公开(公告)日：2021-11-18

申请号：US16874194

申请日：2020-05-14

Applicant: Google LLC

Inventor： Sue Yun Teng ,  Shinnosuke Yamamoto

IPC: H01R12/85

Abstract: The present disclosure provides systems for applying a compression load on at least part of an application specific integrated circuit (“ASIC”) ball grid array (“BGA”) package during the rework or secondary reflow process. The compression-loading assembly may include a top plate and a compression plate. The compression plate may exert a compression load on at least part of the ASIC using one or more compression mechanisms. The compression mechanisms may each include a bolt and a spring. The bolt may releasably couple the top plate to the compression plate and allow for adjustments to the compression load. The spring may be positioned on the bolt between the top plate and the compression plate and, therefore, may exert a force in a direction away from the top plate and toward the compression plate. The compression load may retain the solder joint and may prevent the solder separation defect during the reflow process.