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    Implantable wireless sensor
    8.
    发明授权
    Implantable wireless sensor 有权
    可植入无线传感器

    公开(公告)号：US09265428B2

    公开(公告)日：2016-02-23

    申请号：US12175803

    申请日：2008-07-18

    Applicant: David O'Brien ,  Jason White ,  Michael A. Fonseca ,  Jason Kroh ,  Mark Allen ,  David Stern

    Inventor： David O'Brien ,  Jason White ,  Michael A. Fonseca ,  Jason Kroh ,  Mark Allen ,  David Stern

    IPC: A61B5/02 ,  A61B5/00 ,  A61B5/07

    CPC classification number: A61B5/02014 ,  A61B5/0031 ,  A61B5/076 ,  Y10T29/49016 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073

    Abstract: A wireless sensor for indicating a physical state within an environment includes a housing defining a hermetically sealed cavity. A structure located within the cavity of the housing has elements providing capacitance, the elements being arranged such that the distance and thereby the capacitance of the structure changes when a physical state of the environment changes. The structure has a resonant frequency based at least in part on the capacitance of the structure when in the presence of a fluctuating electromagnetic field. When the sensor is positioned within an environment and is subjected to a fluctuating electromagnetic field, the resonant frequency indicates the physical state of the environment.

    Abstract translation: 用于指示环境中的物理状态的无线传感器包括限定密封空腔的壳体。 位于壳体的腔内的结构具有提供电容的元件，该元件被布置成使得当环境的物理状态改变时，结构的距离以及由此的结构的电容改变。 当存在波动的电磁场时，该结构至少部分地基于结构的电容。 当传感器位于环境中并且经受波动的电磁场时，谐振频率表示环境的物理状态。

    Method for manufacturing conductors and semiconductors
    9.
    发明授权
    Method for manufacturing conductors and semiconductors 有权
    制造导体和半导体的方法

    公开(公告)号：US09011762B2

    公开(公告)日：2015-04-21

    申请号：US12374179

    申请日：2007-07-05

    Applicant: Heikki Seppä ,  Mark Allen

    Inventor： Heikki Seppä ,  Mark Allen

    IPC: B22F7/00 ,  B22F1/02 ,  H05K3/12 ,  H05K3/32 ,  B22F7/04

    CPC classification number: H05K3/321 ,  B22F1/02 ,  B22F7/04 ,  B22F2203/11 ,  B22F2999/00 ,  H01L2224/8184 ,  H05K3/1283 ,  H05K2201/0257 ,  H05K2203/105 ,  H05K2203/1115 ,  H05K2203/1131

    Abstract: The invention relates to a sintering method for manufacturing structures by sintering. In addition, the invention relates to a sintered product, an electronic module, and new uses. In the method, a particle material containing conductive or semiconductive encapsulated nanoparticles is sintered, in order to increase its electrical conductivity, by applying a voltage over the particle material. In the method, a substrate is typically used, one surface of which is at least partly equipped with a layer containing nanoparticles. The method is based on thermal feedback between the voltage feed and the nanoparticles. The invention permits the manufacture of conductive and semiconductive structures and pieces by sintering at room temperature and at normal pressure.

    Abstract translation: 本发明涉及通过烧结制造结构的烧结方法。 此外，本发明涉及烧结产品，电子模块和新用途。 在该方法中，通过在颗粒材料上施加电压，烧结含有导电或半导体封装的纳米颗粒的颗粒材料，以增加其导电性。 在该方法中，通常使用基底，其一个表面至少部分地装有含有纳米粒子的层。 该方法基于电压馈送和纳米颗粒之间的热反馈。 本发明允许通过在室温和常压下烧结来制造导电和半导体结构和片。

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