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    Method to electrically connect chip with top connectors using 3D printing
    2.
    发明授权
    Method to electrically connect chip with top connectors using 3D printing 有权

    公开(公告)号：US12046575B2

    公开(公告)日：2024-07-23

    申请号：US15929281

    申请日：2020-04-22

    申请人： IO Tech Group Ltd.

    发明人： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC分类号： H05K3/00 ,  H01L23/00 ,  H05K3/12 ,  H05K3/32

    CPC分类号： H01L24/82 ,  H05K3/1283 ,  H05K3/32 ,  H01L2224/82051 ,  H01L2224/82103 ,  H01L2224/8284

    摘要： A method for fabricating a three-dimensional (3D) electronic device. A liquid support material (e.g., an epoxy acrylate with a photoinitiator) is applied by a laser-induced forward transfer (LIFT) process to a printed circuit board (PCB) having one or more connectors and one or more electronic components thereon, and then cured to solid form by cooling and/or exposure to ultraviolet (UV) radiation. A layer of conductive material (e.g., a metal) is printed on the solidified support material by LIFT to electrically connect the one or more electronic components to respective ones of the connectors on the PCB. Subsequently, the layer of conductive material is dried by heating and metal particles in the conductive layer sintered using a laser beam. The assembly may then be encapsulated in an encapsulant.

    Electronic-circuit printing using low-cost ink
    7.
    发明授权
    Electronic-circuit printing using low-cost ink 有权

    公开(公告)号：US11706874B2

    公开(公告)日：2023-07-18

    申请号：US16533656

    申请日：2019-08-06

    申请人： Microsoft Technology Licensing, LLC

    发明人： Siyuan Ma ,  James David Holbery

    IPC分类号： H05K3/12 ,  C09D11/52 ,  H05K1/09

    CPC分类号： H05K3/125 ,  C09D11/52 ,  H05K1/092 ,  H05K3/1258 ,  H05K3/1283

    摘要： A method to manufacture an article comprises applying an ink to a substrate. The ink includes a liquid vehicle, a plurality of solid metal particles, a plurality of gallium-containing particles, and a thermally activated flux. The method further comprises curing the ink by heating the substrate to within an activation temperature range of the flux. The article manufactured by this method comprises a substrate, an electronically conductive film arranged on the substrate, and an adherent barrier layer covering both the substrate and the film. The film includes a plurality of solid metal particles with a gallium-based liquid metal bridging the plurality of solid metal particles.

    ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
    10.
    发明公开
    ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20230145507A1

    公开(公告)日：2023-05-11

    申请号：US17958635

    申请日：2022-10-03

    申请人： JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED

    发明人： Osamu HASHIGUCHI

    IPC分类号： H05K3/30 ,  H05K3/34 ,  H05K3/12

    CPC分类号： H05K3/303 ,  H05K3/3494 ,  H05K3/3421 ,  H05K3/1283 ,  H05K3/12

    摘要： A connector includes lead parts and terminal parts to be connected to lands of a substrate, respectively. An anisotropic conductive joining member (ACJM) is mounted in a region where the lead parts are located. The ACJM is a resin in which solder particles are dispersed. The resin can melt at a temperature lower than the melting point of the solder particles. Cream solder is placed on the lands to be connected to the terminal parts. The substrate on which the connector is mounted is passed through a reflow oven to heat both the substrate and the connector. The connection between the terminal parts and the lands by reflow soldering and the connection between the lead parts and the lands via the ACJM 40 are performed simultaneously with each other.