公开(公告)号：US12091567B2

公开(公告)日：2024-09-17

申请号：US17591264

申请日：2022-02-02

Applicant: Kuprion, Inc.

Inventor： Zhenggang Li ,  Yeng Ming Lam ,  Chee Lip Gan ,  Jaewon Kim ,  Alfred A. Zinn

IPC: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/00 ,  B41M7/00 ,  B82Y30/00 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/02 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64

CPC classification number: C09D11/52 ,  B22F1/052 ,  B22F1/0545 ,  B22F1/102 ,  B41M5/0023 ,  B41M7/009 ,  B82Y40/00 ,  C09D5/24 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/38 ,  H01B1/026 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0016 ,  H05K1/097 ,  H05K3/1283 ,  B22F7/08 ,  B22F10/10 ,  B22F10/25 ,  B22F10/28 ,  B22F10/40 ,  B22F10/64 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y30/00 ,  H05K2201/0245 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  B22F2999/00 ,  B22F1/054 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2998/10 ,  B22F10/10 ,  B22F3/10 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/054 ,  B22F1/0551 ,  B22F1/0547 ,  B22F2999/00 ,  B22F1/056 ,  B22F1/0547 ,  B22F1/065 ,  B22F1/0551 ,  B22F2999/00 ,  B22F1/065 ,  B22F1/056 ,  B22F1/0551 ,  B22F1/0547

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

公开(公告)号：US10076032B2

公开(公告)日：2018-09-11

申请号：US15127165

申请日：2015-03-19

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi Kasuga ,  Yoshio Oka ,  Shigeyoshi Nakayama ,  Jinjoo Park ,  Sumito Uehara ,  Kousuke Miura ,  Hiroshi Ueda

IPC: H05K1/05 ,  H05K1/09 ,  H05K3/02 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K1/092 ,  H05K1/05 ,  H05K3/022 ,  H05K3/108 ,  H05K3/38 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0257 ,  H05K2203/0709 ,  H05K2203/072

Abstract: A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

公开(公告)号：US20180213644A1

公开(公告)日：2018-07-26

申请号：US15880670

申请日：2018-01-26

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyasu Noto ,  Yoshinori Takenaka

IPC: H05K1/11 ,  H05K1/03

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H05K1/0373 ,  H05K1/116 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/068 ,  H05K2201/0939 ,  H05K2201/09509 ,  H05K2201/09827

Abstract: A printed wiring board includes an interlayer resin insulating layer including resin and inorganic particles, a via conductor formed through the insulating layer, a first conductor layer formed on the first surface of the insulating layer and including a land portion of the via conductor on the first surface, and a second conductor layer formed on second surface of the insulating layer and connected to bottom of the via conductor. The bottom of the via conductor has diameter of 20 to 35 μm, the first conductor layer has thickness of 3 to 12 μm, the insulating layer has thickness of 1 to 15 μm, the second conductor layer has thickness of 1 to 12 μm, and the second conductor and insulating layers are formed such that T1/T2 is 0.06 to 7.00 where T1 represents the thickness of the second conductor layer, and T2 represents the thickness of the insulating layer.

公开(公告)号：US09867273B2

公开(公告)日：2018-01-09

申请号：US15253841

申请日：2016-08-31

Applicant: Winbond Electronics Corp.

Inventor： Yu-Hsuan Ho

IPC: H01L21/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/12 ,  H05K3/22 ,  H01L29/786 ,  H01L29/45 ,  H01L21/288 ,  H01L29/66 ,  H01L21/02

CPC classification number: H05K1/0201 ,  H01L21/02175 ,  H01L21/02186 ,  H01L21/02288 ,  H01L21/288 ,  H01L29/45 ,  H01L29/66742 ,  H01L29/78618 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/097 ,  H05K3/12 ,  H05K3/22 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2203/0783 ,  H05K2203/1194

Abstract: A printed circuit, a thin film transistor and manufacturing methods thereof are provided. The printed circuit includes a plurality of metal nanostructures and a metal oxide layer. The metal oxide layer is disposed on a surface of the metal nanostructures and fills a space at an intersection of the metal nanostructures. The metal oxide layer disposed on the surface of the metal nanostructures has a thickness of 0.1 nm to 10 nm.

公开(公告)号：US20170367192A1

公开(公告)日：2017-12-21

申请号：US15612357

申请日：2017-06-02

Applicant: Nanoshield Technology Co. Ltd.

Inventor： James Cheng LEE

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K3/284 ,  H05K1/185 ,  H05K3/285 ,  H05K3/303 ,  H05K2201/0104 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0179 ,  H05K2201/0257 ,  H05K2203/1333

Abstract: A method for waterproofing a device and the resulting device are provided. The device includes a printed circuit board assembly (PCBA), which includes a printed circuit board, and at least one electronic component disposed on the printed circuit board. A waterproof coating such as a polymer coating is disposed on or in contact with at least one portion of the at least one electronic component. A nanofilm is disposed on the PCBA. The nanofilm includes an inner coating and an outer coating. The inner coating is disposed on the printed circuit board or in contact with the waterproof coating. The inner coating comprises metal oxide nanoparticles having a particle diameter in a range of about 5 nm to about 100 nm. The outer coating in contact with the inner coating, and comprises silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

公开(公告)号：US09796052B2

公开(公告)日：2017-10-24

申请号：US14389668

申请日：2012-03-30

Applicant: Teruo Komatsu ,  Ryo Matsubayashi

Inventor： Teruo Komatsu ,  Ryo Matsubayashi

IPC: B23K35/00 ,  B23K35/22 ,  B23K35/02 ,  H01B1/22 ,  B22F1/00 ,  H01B1/02 ,  H05K1/09 ,  B23K1/20 ,  B23K35/30 ,  B23K35/36 ,  B22F7/06

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

公开(公告)号：US20170267899A1

公开(公告)日：2017-09-21

申请号：US15101801

申请日：2014-10-24

Applicant: Cima NanoTech Israel Ltd.

Inventor： Jonathan Alton Brodd ,  Chandarasekaran Krishnan ,  Jing Jiang ,  Dov Zamir

IPC: C09J7/02 ,  H05K9/00 ,  H01B3/44 ,  H01B1/22 ,  H01B13/00

CPC classification number: H01B13/0036 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2433/006 ,  C09J2467/006 ,  H01B1/22 ,  H01B3/447 ,  H01B13/003 ,  H05K1/0224 ,  H05K3/207 ,  H05K9/0083 ,  H05K2201/0108 ,  H05K2201/0257

Abstract: A process for preparing an electrically conductive, adhesive tape that includes: (a) providing an article comprising a substrate and a network of electrically conductive metal traces defining cells that are transparent to visible light on the substrate; (b) embedding the network of electrically conductive traces in a polymer matrix having a surface on which a pressure sensitive adhesive is deposited; and (c) removing the substrate to form the electrically conductive, adhesive tape.

公开(公告)号：US09756724B2

公开(公告)日：2017-09-05

申请号：US13252256

申请日：2011-10-04

Applicant: Rabindra N. Das ,  Kostas I. Papathomas ,  Voya R. Markovich

Inventor： Rabindra N. Das ,  Kostas I. Papathomas ,  Voya R. Markovich

IPC: H05K3/40 ,  H05K1/03 ,  H05K3/46 ,  B23K26/382 ,  B23K26/40 ,  H01B1/22 ,  H05K1/09 ,  B23K103/00 ,  B23K101/40 ,  B23K103/16

CPC classification number: H05K1/0313 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/52 ,  H01B1/22 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/097 ,  H05K3/4053 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0257 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/10378 ,  H05K2203/0425 ,  H05K2203/1152 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto.

公开(公告)号：US09657404B2

公开(公告)日：2017-05-23

申请号：US14316809

申请日：2014-06-27

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Shih-Hong Chen ,  Yu-Fu Kuo ,  Tzu-Wen Chuang

IPC: H05K3/10 ,  C25D5/02 ,  C25D5/56 ,  H05K3/24

CPC classification number: C25D5/02 ,  C25D5/56 ,  H05K3/105 ,  H05K3/24 ,  H05K2201/0257 ,  H05K2203/107

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

公开(公告)号：US20170127515A1

公开(公告)日：2017-05-04

申请号：US15400218

申请日：2017-01-06

Applicant: RAMOT AT TEL-AVIV UNIVERSITY LTD

Inventor： Gil MARKOVICH ,  Daniel AZULAI ,  Olga KRICHEVSKI

IPC: H05K1/09 ,  C23C18/40 ,  C23C18/44 ,  H01L29/786 ,  C23C18/16 ,  H01B1/02 ,  H05K1/02 ,  C23C18/34 ,  C23C18/48

CPC classification number: H05K1/09 ,  C23C18/14 ,  C23C18/166 ,  C23C18/1667 ,  C23C18/1676 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44 ,  C23C18/48 ,  H01B1/02 ,  H01L29/786 ,  H05K1/0274 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2203/013 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10T428/24917

Abstract: A conductive nanowire film having a high aspect-ratio metal is described. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.