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1.
公开(公告)号:US07580261B2
公开(公告)日:2009-08-25
申请号:US11685726
申请日:2007-03-13
CPC分类号: H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要: A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
摘要翻译: 提供冷却系统以与半导体组件结合使用,所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道,流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征,其构造成在其中接收细长的电连接。