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公开(公告)号：US07580261B2
公开(公告)日：2009-08-25
申请号：US11685726
申请日：2007-03-13
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
摘要翻译： 提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。
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公开(公告)号：US20080225482A1
公开(公告)日：2008-09-18
申请号：US11685726
申请日：2007-03-13
IPC分类号： H05K7/20
CPC分类号： H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.
摘要翻译： 提供冷却系统以与半导体组件结合使用，所述半导体组件包括通过细长的电连接与第一半导体器件电连接的第一半导体器件和第二半导体器件。 冷却系统包括流动通道，流体地联接到流动通道的泵以及流体耦合到流动通道并被配置为将冷却剂流体引导到第二半导体器件上的出口阵列。 出口阵列具有形成在其中的互连特征，其构造成在其中接收细长的电连接。
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公开(公告)号：US08400775B2
公开(公告)日：2013-03-19
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K1/18
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译： 为功率逆变器模块提供了一个子部件。 该装置包括具有端子并且集成到壳体中的电容器。 衬底安装在壳体上。 该基板包括功率半导体开关，并具有至少一个直流（DC）接头。 直流标签直接连接到电容器的端子。
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公开(公告)号：US20090009980A1
公开(公告)日：2009-01-08
申请号：US11774329
申请日：2007-07-06
申请人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
发明人： Terence G. Ward , George John , Edward P. Yankoski , David F. Nelson , Gregory S. Smith , James M. Nagashima
IPC分类号： H05K7/00 , H02M7/5387 , H05K1/00
CPC分类号： H02M7/003
摘要： A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.
摘要翻译： 为功率逆变器模块提供一个子部件。 该装置包括具有端子并且集成到壳体中的电容器。 衬底安装在壳体上。 该基板包括功率半导体开关，并具有至少一个直流（DC）接头。 直流标签直接连接到电容器的端子。
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公开(公告)号：US07911161B2
公开(公告)日：2011-03-22
申请号：US11769772
申请日：2007-06-28
IPC分类号： H02P1/00
CPC分类号： B60K6/485 , B60K6/405 , H01L2924/0002 , Y02T10/6226 , H01L2924/00
摘要： An automotive power inverter is provided. The power inverter includes a chassis, a microelectronic die coupled to the chassis and having an integrated circuit formed thereon, and an insulating region between the chassis and the microelectronic die.
摘要翻译： 提供汽车电源逆变器。 功率逆变器包括底盘，耦合到底盘并且具有形成在其上的集成电路的微电子管芯，以及底架和微电子管芯之间的绝缘区域。
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公开(公告)号：US20090001909A1
公开(公告)日：2009-01-01
申请号：US11769772
申请日：2007-06-28
CPC分类号： B60K6/485 , B60K6/405 , H01L2924/0002 , Y02T10/6226 , H01L2924/00
摘要： An automotive power inverter is provided. The power inverter includes a chassis, a microelectronic die coupled to the chassis and having an integrated circuit formed thereon, and an insulating region between the chassis and the microelectronic die.
摘要翻译： 提供汽车电源逆变器。 功率逆变器包括底盘，耦合到底盘并且具有形成在其上的集成电路的微电子管芯，以及底架和微电子管芯之间的绝缘区域。
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公开(公告)号：US08053920B2
公开(公告)日：2011-11-08
申请号：US12178897
申请日：2008-07-24
IPC分类号： B60L1/00
CPC分类号： H02M7/003 , H01L2224/49111
摘要： A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.
摘要翻译： 提供了一种用于功率转换器的端子组件。 端子组件包括第一和第二导电部件和电流传感器。 第一导电组件具有第一和第二可释放的附接结构。 第二导电部件具有相应的第一和第二宽度的第一和第二部分。 第一宽度小于第二宽度。 第一部分通过第二可释放的连接结构可释放地附接到第一导电部件。 电流传感器具有穿过其的开口并且位于第一导电部件和第二导电部件的第二部分之间，使得第一导电部件的第一部分延伸穿过开口。 电流传感器响应于流过第二导电部件的第一部分的电流。
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8.发明申请公开(公告)号：US20080303056A1
公开(公告)日：2008-12-11
申请号：US11758859
申请日：2007-06-06
IPC分类号： H01L29/74 , H01L21/332
CPC分类号： H01L24/40 , H01L24/37 , H01L25/072 , H01L2224/37011 , H01L2224/40091 , H01L2224/40225 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/00
摘要： A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.
摘要翻译： 提供了一种用于大功率，交流电动机应用的逆变器电路的开关模块中的半导体子组件。 半导体子组件包括具有第一和第二相对的金属化面的晶片; 电耦合到所述晶片的所述第一金属化面并且具有至少一个电极区域的半导体开关器件; 以及连接到半导体开关器件的互连。 互连包括结合到半导体开关器件的至少一个电极区域的第一金属层，接合到第一金属层的陶瓷层，限定用于接触第一金属层的通孔的陶瓷层，接合到第一金属层的第二金属层 陶瓷层和设置在陶瓷层的通孔中的导电物质，以将第一金属层电耦合到第二金属层。
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公开(公告)号：US08063440B2
公开(公告)日：2011-11-22
申请号：US12473632
申请日：2009-05-28
CPC分类号： H01L25/18 , H01L2924/0002 , H01L2924/13055 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/4913 , H01L2924/00
摘要： A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.
摘要翻译： 提供电力电子电源模块。 电力电子功率模块包括导电衬底，具有第一和第二相对表面的电子管芯以及形成在其上的至少一个晶体管，该电子管芯安装在导电衬底上，并且至少一个晶体管被配置成使得当 至少一个晶体管被激活，电流从电子管芯的第一表面流入导电衬底，以及至少部分嵌入导电衬底中的控制构件，该控制构件具有形成在其上的控制导体并电连接到 所述至少一个晶体管使得当控制信号被提供给所述控制导体时，所述至少一个晶体管被激活。
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公开(公告)号：US20100109351A1
公开(公告)日：2010-05-06
申请号：US12263155
申请日：2008-10-31
CPC分类号： F16B5/0635 , Y10T292/214 , Y10T292/216 , Y10T292/221
摘要： A system is provided for securing a cover having a first surface onto a chassis having a rim, the rim having a second surface. The system comprises a clamping rail and a fastener coupled to the rail. The clamping rail is configured to form a loop that circumferentially engages the first surface and the second surface and, when constricted, produces a first force substantially coplanar with the loop. The fastener is configured to constrict the rail, the rail and the first and second surfaces configured to produce a second force having a component substantially orthogonal to the loop when the rail is constricted.
摘要翻译： 提供了一种用于将具有第一表面的盖固定到具有边缘的底架上的系统，所述边缘具有第二表面。 该系统包括夹紧轨道和联接到轨道的紧固件。 夹紧轨道构造成形成环，其环绕第一表面和第二表面接合，并且当收缩时产生与环基本上共面的第一力。 紧固件被构造成收缩轨道，轨道以及被构造成当轨道收缩时产生具有与环路基本正交的分量的第二力的第二和第二表面。
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