专利检索 ap:("Guiyun Bai" OR "Sushrutha Gujjula" OR "Ronald L. Spreitzer" OR "Naresh Satyan" OR "David Mathine" OR "Sam Khalili" OR "Sanjeev Gupta" OR "Eleanor Patricia Paras Rabadam" OR "Ankur Agrawal" OR "Kenneth Brown" OR "Jonathan Doylend" OR "Daniel Grodensky" OR "Israel Petronius") AND inv:"Sam Khalili" 第 1 页

1.

发明申请
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE 有权

公开(公告)号：US20220390562A1

公开(公告)日：2022-12-08

申请号：US17557290

申请日：2021-12-21

申请人： Guiyun Bai , Sushrutha Gujjula , Ronald L. Spreitzer , Naresh Satyan , David Mathine , Sam Khalili , Sanjeev Gupta , Eleanor Patricia Paras Rabadam , Ankur Agrawal , Kenneth Brown , Jonathan Doylend , Daniel Grodensky , Israel Petronius

发明人： Guiyun Bai , Sushrutha Gujjula , Ronald L. Spreitzer , Naresh Satyan , David Mathine , Sam Khalili , Sanjeev Gupta , Eleanor Patricia Paras Rabadam , Ankur Agrawal , Kenneth Brown , Jonathan Doylend , Daniel Grodensky , Israel Petronius

IPC分类号： G01S7/481 , B81B7/02 , G01S17/931

摘要： Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.