专利检索 ap:("Guiyun Bai" OR "Sushrutha Gujjula" OR "Ronald L. Spreitzer" OR "Naresh Satyan" OR "David Mathine" OR "Sam Khalili" OR "Sanjeev Gupta" OR "Eleanor Patricia Paras Rabadam" OR "Ankur Agrawal" OR "Kenneth Brown" OR "Jonathan Doylend" OR "Daniel Grodensky" OR "Israel Petronius") AND inv:"Eleanor Patricia Paras Rabadam" 第 1 页

1.

发明申请
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE 有权

公开(公告)号：US20220390562A1

公开(公告)日：2022-12-08

申请号：US17557290

申请日：2021-12-21

申请人： Guiyun Bai , Sushrutha Gujjula , Ronald L. Spreitzer , Naresh Satyan , David Mathine , Sam Khalili , Sanjeev Gupta , Eleanor Patricia Paras Rabadam , Ankur Agrawal , Kenneth Brown , Jonathan Doylend , Daniel Grodensky , Israel Petronius

发明人： Guiyun Bai , Sushrutha Gujjula , Ronald L. Spreitzer , Naresh Satyan , David Mathine , Sam Khalili , Sanjeev Gupta , Eleanor Patricia Paras Rabadam , Ankur Agrawal , Kenneth Brown , Jonathan Doylend , Daniel Grodensky , Israel Petronius

IPC分类号： G01S7/481 , B81B7/02 , G01S17/931

摘要： Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.

2.

发明公开
INTERPOSER INTERCONNECTS AND ENCLOSURE FOR SILICON PHOTONICS LIDAR MODULE 审中-公开

公开(公告)号：US20230197699A1

公开(公告)日：2023-06-22

申请号：US17553995

申请日：2021-12-17

申请人： Ronald L. Spreitzer , Ankur Agrawal , Guiyun Bai , Eleanor Patricia Paras Rabadam , Sanjeev Gupta

发明人： Ronald L. Spreitzer , Ankur Agrawal , Guiyun Bai , Eleanor Patricia Paras Rabadam , Sanjeev Gupta

IPC分类号： H01L25/16 , G01S7/481 , H01L23/00 , H01L25/075

CPC分类号： H01L25/167 , G01S7/481 , H01L24/17 , H01L25/0756 , H01L2924/12042

摘要： Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.