公开(公告)号：US20230080101A1

公开(公告)日：2023-03-16

申请号：US17930112

申请日：2022-09-07

申请人： HAESUNG DS CO., LTD.

发明人： Dong Jin YOON ,  Sung Il KANG ,  In Seob BAE ,  Seok Kyu SEO ,  Dong Young PYEON

IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053

摘要： Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trench is provided and an upper surface in which a second trench and a third trench are provided, including a circuit pattern and a conductive material; a first resin arranged in the first trench; and a second resin arranged in the second trench and the third trench, wherein the second trench exposes at least a part of the first resin.

公开(公告)号：US20240194571A1

公开(公告)日：2024-06-13

申请号：US17620053

申请日：2021-07-01

申请人： HAESUNG DS CO., LTD.

发明人： Do Yeon WOO ,  Seok Kyu SEO ,  Byoungchul CHOI

IPC分类号： H01L23/495

CPC分类号： H01L23/49548

摘要： According to an aspect of the present disclosure, provided is a lead frame including a plurality of lead with a lead groove formed therein; and a dambar arranged between the leads to connect the leads, wherein a thickness of the dambar arranged between the leads has at least two thickness values, and a dambar groove is formed between a thickest portion of the dambar and the lead neighboring the thickest portion of the dambar.

公开(公告)号：US20230102887A1

公开(公告)日：2023-03-30

申请号：US17930537

申请日：2022-09-08

申请人： HAESUNG DS CO., LTD.

发明人： Dong Jin Yoon ,  Sung Il Kang ,  In Seob BAE ,  Seok Kyu SEO ,  Dong Young Pyeon

IPC分类号： H01L23/495 ,  H01L21/56

摘要： A lead frame includes: leads; and a dambar arranged between the leads and connecting the leads to each other, wherein each of the leads includes: a lower lead groove formed in a first surface for a wettable flank structure; and an upper lead groove formed in a second surface opposite the first surface and aligned with the lower lead groove in a thickness direction, wherein in a sawing process, a portion of the lead between the lower lead groove and the upper lead groove is at least partially removed.