公开(公告)号：US20240365502A1

公开(公告)日：2024-10-31

申请号：US18308814

申请日：2023-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ching-Chun Hsu ,  Kai Zhang ,  Sung-Hsia Kuo ,  Hsin Chang Lu ,  John R. Grady

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20836

Abstract: disclosed. The electronic device includes a chassis, electronic components disposed within the chassis, the cooling containers, and a coolant loop. The chassis has an internal volume partly filled with coolant to form coolant pool in the internal volume. The containers are disposed within the chassis such that each container contains at least one electronic component. The coolant loop circulates the coolant from the coolant pool to the containers. For example, each container receives an inflow of the coolant from the coolant loop or from another one container and immerse the at least one electronic component in the coolant to remove heat from the at least one electronic component and output an outflow of the coolant that overflows into the coolant pool or into at least one adjacent container, where a level of the coolant in the coolant pool is lower than respective levels of the coolant in the containers.