公开(公告)号：US20240365502A1

公开(公告)日：2024-10-31

申请号：US18308814

申请日：2023-04-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ching-Chun Hsu ,  Kai Zhang ,  Sung-Hsia Kuo ,  Hsin Chang Lu ,  John R. Grady

IPC: H05K7/20

CPC classification number: H05K7/20236 ,  H05K7/20263 ,  H05K7/20272 ,  H05K7/20772 ,  H05K7/20836

Abstract: disclosed. The electronic device includes a chassis, electronic components disposed within the chassis, the cooling containers, and a coolant loop. The chassis has an internal volume partly filled with coolant to form coolant pool in the internal volume. The containers are disposed within the chassis such that each container contains at least one electronic component. The coolant loop circulates the coolant from the coolant pool to the containers. For example, each container receives an inflow of the coolant from the coolant loop or from another one container and immerse the at least one electronic component in the coolant to remove heat from the at least one electronic component and output an outflow of the coolant that overflows into the coolant pool or into at least one adjacent container, where a level of the coolant in the coolant pool is lower than respective levels of the coolant in the containers.

公开(公告)号：US11452237B2

公开(公告)日：2022-09-20

申请号：US17073090

申请日：2020-10-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Chong S. Tan ,  Joseph Allen ,  Kai Zhang

IPC: H05K7/20 ,  F16L37/30 ,  F16L37/26

Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.

公开(公告)号：US20180073514A1

公开(公告)日：2018-03-15

申请号：US15264889

申请日：2016-09-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Kai Zhang ,  Rachel Pollock ,  Sze Hau Loh

IPC: F04D27/00 ,  F04D25/16 ,  F04D25/08 ,  F04D29/32

CPC classification number: F04D27/008 ,  F04D25/08 ,  F04D25/166 ,  F04D29/329 ,  F05B2240/20 ,  F05D2260/902

Abstract: In various examples, a device comprises a fan. The fan comprises a rotor hub, and a linear solenoid. The linear solenoid comprises a magnetic coil, a pin, and a spring surrounding the pin to bias the pin. Responsive to the fan losing power, the solenoid to: cause the pin to contact the rotor hub to cause the rotor hub to stop spinning.

公开(公告)号：US20180017064A1

公开(公告)日：2018-01-18

申请号：US15210192

申请日：2016-07-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Rachel Pollock ,  Sze Hau Loh ,  Richard A. Bargerhuff ,  Giang Tran ,  Kai Zhang

IPC: F04D27/00 ,  F04D29/26 ,  F04D25/06

CPC classification number: F04D27/001 ,  F05D2230/72

Abstract: In various examples, a fan comprises a fan rotor, logic, and a component electrically coupled to the fan rotor to control operation of the fan rotor. The logic may determine that the component has failed. Responsive to determining that the component has failed, the logic to cause a backup component to apply power to the fan rotor, wherein applying the power causes blades of the fan to reduce spinning.

公开(公告)号：US20220124942A1

公开(公告)日：2022-04-21

申请号：US17073090

申请日：2020-10-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Chong S. Tan ,  Joseph Allen ,  Kai Zhang

IPC: H05K7/20 ,  F16L37/26 ,  F16L37/30

Abstract: Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.