公开(公告)号：US11853134B2

公开(公告)日：2023-12-26

申请号：US17498925

申请日：2021-10-12

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Vincent W. Michna ,  David S. Chialastri ,  Nilashis Dey ,  Yasir Jamal

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/20254 ,  G06F2200/201 ,  H05K7/20272

Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

公开(公告)号：US20230114466A1

公开(公告)日：2023-04-13

申请号：US17498925

申请日：2021-10-12

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Vincent W. Michna ,  David S. Chialastri ,  Nilashis Dey ,  Yasir Jamal

IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.