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    PROVIDING VIDEO CONTENT FOR PRE-BOOT AND POST-BOOT ENVIRONMENTS OF COMPUTER PLATFORMS
    2.
    发明申请
    PROVIDING VIDEO CONTENT FOR PRE-BOOT AND POST-BOOT ENVIRONMENTS OF COMPUTER PLATFORMS 有权

    公开(公告)号：US20230099385A1

    公开(公告)日：2023-03-30

    申请号：US17449572

    申请日：2021-09-30

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Vincent W. Michna ,  Yasir Jamal ,  Peter A. Hansen

    IPC: H04N5/268

    Abstract: A process includes, responsive to a computer platform being in a pre-operating system mode of operation, a first controller receiving serial data from a first external communication connector of the computer platform and the first controller providing a video output based on the serial data; and routing the video output of the first controller to a display device connector. The process includes, determining whether a video driver of the computer platform is communicating with a second controller via a second external communication connector of the computer platform. The video driver is associated with an operating system mode of operation of the computer platform. The process includes, in response to determining that the video driver is communicating with the second controller, routing a video output of the second controller to the display device connector in place of the video output of the first controller.

    Backplane keying mechanism
    4.
    发明申请
    Backplane keying mechanism 审中-公开

    公开(公告)号：US20200100380A1

    公开(公告)日：2020-03-26

    申请号：US16139261

    申请日：2018-09-24

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： Vincent W. Michna ,  Nilashis Dey ,  Charles Cornwell ,  David Chialastri

    IPC: H05K7/14 ,  H01H13/86 ,  G06F3/02

    Abstract: Examples described herein include a backplane keying mechanism. The backplane keying mechanism may include a backplane, a first connector, a second connector, a first block for the first connector, and a second block for the second connector. The first block and the second block may be moveable as one unit on the backplane from a first state to a second state. In the first state, the first block allows the first connect to connect to a first type of device and the second block allows the second connector to connect to the first type of device. In the second state, the first block prohibits the first connector from connecting to the first type of device and the second block prohibits the second connector from connecting to the first type of device.

    Providing video content for pre-boot and post-boot environments of computer platforms
    5.
    发明授权
    Providing video content for pre-boot and post-boot environments of computer platforms 有权

    公开(公告)号：US12035068B2

    公开(公告)日：2024-07-09

    申请号：US17449572

    申请日：2021-09-30

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Vincent W. Michna ,  Yasir Jamal ,  Peter A. Hansen

    IPC: H04N5/268 ,  G06F13/40

    CPC classification number: H04N5/268 ,  G06F13/4022

    Abstract: A process includes, responsive to a computer platform being in a pre-operating system mode of operation, a first controller receiving serial data from a first external communication connector of the computer platform and the first controller providing a video output based on the serial data; and routing the video output of the first controller to a display device connector. The process includes, determining whether a video driver of the computer platform is communicating with a second controller via a second external communication connector of the computer platform. The video driver is associated with an operating system mode of operation of the computer platform. The process includes, in response to determining that the video driver is communicating with the second controller, routing a video output of the second controller to the display device connector in place of the video output of the first controller.

    Fluid cooling assembly for a computing system
    6.
    发明授权
    Fluid cooling assembly for a computing system 有权

    公开(公告)号：US11853134B2

    公开(公告)日：2023-12-26

    申请号：US17498925

    申请日：2021-10-12

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Vincent W. Michna ,  David S. Chialastri ,  Nilashis Dey ,  Yasir Jamal

    IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

    CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/20254 ,  G06F2200/201 ,  H05K7/20272

    Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

    AIR FLOW IMPEDANCE BALANCING IN ENCLOSURES
    7.
    发明申请
    AIR FLOW IMPEDANCE BALANCING IN ENCLOSURES 审中-公开

    公开(公告)号：US20200245503A1

    公开(公告)日：2020-07-30

    申请号：US16258887

    申请日：2019-01-28

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： David Chialastri ,  Travis J. Gaskill ,  Vincent W. Michna ,  Nilashis Dey ,  Patrick Raymond

    IPC: H05K7/20 ,  F25D23/12

    Abstract: A method for balancing air flow impedance within an enclosure. The method includes determining a configuration of each hardware module of a plurality of hardware modules arranged in a housing of the enclosure. The method also includes determining impedance settings for a plurality of adjustable air flow impedance elements within the housing, based at least in part on the configurations of the plurality of hardware modules, that will balance air flow impedances of the plurality of hardware modules. The method further includes setting the plurality of adjustable air flow impedance elements according to the determined impedance settings.

    Dual-path high-speed interconnect PCB layout solution
    9.
    发明授权
    Dual-path high-speed interconnect PCB layout solution 有权

    公开(公告)号：US12068554B2

    公开(公告)日：2024-08-20

    申请号：US17587818

    申请日：2022-01-28

    Applicant: Hewlett Packard Enterprise Development LP

    Inventor： Paul Danna ,  Vincent W. Michna ,  Chi Kim Sides

    IPC: H05K3/34 ,  H01R12/70 ,  H01R12/71 ,  H01R43/02

    CPC classification number: H01R12/716 ,  H01R12/707 ,  H01R43/0256 ,  H05K3/3405

    Abstract: A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

    FLUID COOLING ASSEMBLY FOR A COMPUTING SYSTEM
    10.
    发明申请
    FLUID COOLING ASSEMBLY FOR A COMPUTING SYSTEM 有权

    公开(公告)号：US20230114466A1

    公开(公告)日：2023-04-13

    申请号：US17498925

    申请日：2021-10-12

    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

    Inventor： Vincent W. Michna ,  David S. Chialastri ,  Nilashis Dey ,  Yasir Jamal

    IPC: G06F1/20 ,  G06F1/18 ,  H05K7/20

    Abstract: Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

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