公开(公告)号：US20190036248A1

公开(公告)日：2019-01-31

申请号：US15660612

申请日：2017-07-26

Applicant: Hewlett Packard Enterprise Development LP

Inventor： James D. Hensley ,  David G. Rohrer ,  Brent A. Ford

IPC: H01R12/70 ,  H01R12/71 ,  H05K1/02 ,  H05K7/20 ,  H05K1/14 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/716 ,  H01R12/722 ,  H05K1/0278 ,  H05K1/147 ,  H05K1/18 ,  H05K3/303 ,  H05K7/20172 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10333 ,  H05K2203/0228

Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.

公开(公告)号：US20180358753A1

公开(公告)日：2018-12-13

申请号：US15778932

申请日：2015-11-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： James D. Hensley ,  Chadi Farid Theodossy ,  David R. Cowles

IPC: H01R13/659 ,  H04Q1/02

CPC classification number: H01R13/659 ,  H01R24/64 ,  H04Q1/035

Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.

公开(公告)号：US10439307B2

公开(公告)日：2019-10-08

申请号：US15660612

申请日：2017-07-26

Applicant: Hewlett Packard Enterprise Development LP

Inventor： James D. Hensley ,  David G. Rohrer ,  Brent A. Ford

IPC: H01R12/70 ,  H01R12/71 ,  H05K1/02 ,  H05K7/20 ,  H05K1/14 ,  H05K3/30 ,  H01R12/72

Abstract: Examples herein relate to cuts in a circuit board. In some examples, a circuit board can include a signal connector located on the circuit board, and cuts extending through at least a body of the circuit board that are adjacent to the signal connector and extend from a perimeter of the circuit board to an inner portion of the circuit board, where the circuit board flexes relative to the signal connector responsive to the circuit board experiencing a force.

公开(公告)号：US10418754B2

公开(公告)日：2019-09-17

申请号：US15778932

申请日：2015-11-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： James D. Hensley ,  Chadi Farid Theodossy ,  David R. Cowles

IPC: H01R13/648 ,  H01R13/659 ,  H04Q1/02 ,  H01R24/64

Abstract: In some examples, an apparatus includes electronic equipment and a port assembly electrically coupled to the electronic equipment. The port assembly can include a port to receive a plug as well as an electromagnetic interference (EMI) grounding member disposed on the periphery of the port assembly. The apparatus can further include a housing to securely house the equipment. The housing can include a panel with a panel opening for the port assembly. The panel opening can include a vent portion to permit air venting for the electronic equipment through the vent portion of the panel when a plug is plugged into the port.

公开(公告)号：US20190027845A1

公开(公告)日：2019-01-24

申请号：US15657870

申请日：2017-07-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： James D. Hensley ,  David R. Cowles ,  David G. Rohrer

IPC: H01R12/70

CPC classification number: H01R12/7052 ,  H01R12/7047

Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connecter brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.

公开(公告)号：US20250142763A1

公开(公告)日：2025-05-01

申请号：US18497088

申请日：2023-10-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： See Yun Yow ,  James D. Hensley ,  Mun Hoong Tai

IPC: H05K7/20

Abstract: An information processing device comprises heat generating components, a plenum, and fans arranged to flow air through the plenum and to cool the heat generating components. The device also comprises a recirculation inhibition mechanism to reduce the amount of air recirculation in the event a fan fails. The recirculation inhibition mechanism comprises a plenum impedance element extending across the plenum such that the air passing through the plenum passes through the plenum impedance element prior to reaching the fans, and dividers disposed in the plenum and defining sub-compartments in the plenum. Each of the sub-compartments corresponds to one of the fans and is configured to supply air to or receive air from the corresponding fan. In the event of one of the fans failing, air recirculating through the failed fan passes though the plenum impedance element twice before reaching an adjacent fan.

公开(公告)号：US10461450B2

公开(公告)日：2019-10-29

申请号：US15657870

申请日：2017-07-24

Applicant: Hewlett Packard Enterprise Development LP

Inventor： James D. Hensley ,  David R. Cowles ,  David G. Rohrer

IPC: H01R12/00 ,  H01R12/70

Abstract: Example implementations relate signal connector braces. For instance, in an example a signal connector brace can include a housing having an exterior surface, and a protrusion extending from the housing to couple the housing to a via of a circuit board thereby positioning the exterior surface of the housing in contact with a corresponding exterior surface of a signal connector to brace the signal connector.