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公开(公告)号：US20180317337A1
公开(公告)日：2018-11-01
申请号：US15972106
申请日：2018-05-04
发明人： Brian T. Purcell , Zheila N. Madanipour , Chandler Ray Harris , Robert Allen Voss , Michael Bourg
IPC分类号： H05K7/14
CPC分类号： H05K7/1491 , H05K7/1492 , H05K7/1497
摘要： Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement includes a chassis, the chassis being connected to a rack in a data center, and a PCA slidably connected to the chassis via a tray, in which the PCA comprises a number of bill of material (BOM) options to customize the PCA and a single basic input/output system (BIOS) image, and in which the PCA is physically shifted on the chassis to accommodate a cold aisle cabling or a hot aisle cabling arrangement of the data center.
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公开(公告)号：US10349552B2
公开(公告)日：2019-07-09
申请号：US15972106
申请日：2018-05-04
发明人： Brian T Purcell , Zheila N. Madanipour , Chandler Ray Harris , Robert Allen Voss , Michael Bourg
IPC分类号： H05K7/14
摘要： Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement includes a chassis, the chassis being connected to a rack in a data center, and a PCA slidably connected to the chassis via a tray, in which the PCA comprises a number of bill of material (BOM) options to customize the PCA and a single basic input/output system (BIOS) image, and in which the PCA is physically shifted on the chassis to accommodate a cold aisle cabling or a hot aisle cabling arrangement of the data center.
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公开(公告)号：US09992905B2
公开(公告)日：2018-06-05
申请号：US15310576
申请日：2014-05-30
发明人： Brian T. Purcell , Zheila N. Madanipour , Chandler Ray Harris , Robert Allen Voss , Michael Bourg
IPC分类号： H05K7/14
CPC分类号： H05K7/1492 , H05K7/1491
摘要： Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement includes a chassis, the chassis being connected to a rack in a data center, and a PCA slidably connected to the chassis via a tray, in which the PCA comprises a number of bill of material (BOM) options to customize the PCA and a single basic input/output system (BIOS) image, and in which the PCA is physically shifted on the chassis to accommodate a cold aisle cabling or a hot aisle cabling arrangement of the data center.
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公开(公告)号：US20170124246A1
公开(公告)日：2017-05-04
申请号：US15316026
申请日：2014-07-30
IPC分类号： G06F17/50
CPC分类号： G06F17/5077 , G06F17/5045 , G06F17/5068 , G06F17/5072 , H05K3/0005 , H05K2201/09972
摘要： A method is described in which a functional region on a printed circuit board (PCB) is defined, a regional circuit design to be inserted into the functional region on the PCB is selected, and the regional circuit design is pasted into the functional region.
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