公开(公告)号：US10901932B2

公开(公告)日：2021-01-26

申请号：US15119801

申请日：2014-04-23

申请人： HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

发明人： Brian T Purcell ,  David M Koonce ,  Barry L Olawsky ,  Michael White ,  Quoc Hung C Vu ,  Kyran Wilfred Fey, Jr.

IPC分类号： G06F13/40 ,  H05K7/14

摘要： An example device in accordance with an aspect of the present disclosure includes at least one interface set, including a first interface, at least one second interface, and at least one third interface. A first portion of the first interface is coupled to a second portion of the at least one second interface. A second portion of the first interface is coupled to a first portion of the at least one third interface. The first portion of the first interface is isolated from the second portion of the first interface, the first portion of the second interface is isolated from the second portion of the second interface, and the first portion of the third interface is isolated from the second portion of the third interface.

公开(公告)号：US10349552B2

公开(公告)日：2019-07-09

申请号：US15972106

申请日：2018-05-04

申请人： HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

发明人： Brian T Purcell ,  Zheila N. Madanipour ,  Chandler Ray Harris ,  Robert Allen Voss ,  Michael Bourg

IPC分类号： H05K7/14

摘要： Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement includes a chassis, the chassis being connected to a rack in a data center, and a PCA slidably connected to the chassis via a tray, in which the PCA comprises a number of bill of material (BOM) options to customize the PCA and a single basic input/output system (BIOS) image, and in which the PCA is physically shifted on the chassis to accommodate a cold aisle cabling or a hot aisle cabling arrangement of the data center.

公开(公告)号：US20170052919A1

公开(公告)日：2017-02-23

申请号：US15119801

申请日：2014-04-23

申请人： HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

发明人： Brian T Purcell ,  David M Koonce ,  Barry L Olawsky ,  Michael White ,  Quoc Hung C Vu ,  Kyran Wilfred Fey, JR.

IPC分类号： G06F13/40 ,  H05K7/14

CPC分类号： G06F13/4068 ,  G06F13/4022 ,  H05K7/1438

摘要： An example device in accordance with an aspect of the present disclosure includes at least one interface set, including a first interface, at least one second interface, and at least one third interface. A first portion of the first interface is coupled to a second portion of the at least one second interface. A second portion of the first interface is coupled to a first portion of the at least one third interface. The first portion of the first interface is isolated from the second portion of the first interface, the first portion of the second interface is isolated from the second portion of the second interface, and the first portion of the third interface is isolated from the second portion of the third interface.

摘要翻译： 根据本公开的一个方面的示例性设备包括至少一个接口组，包括第一接口，至少一个第二接口和至少一个第三接口。 第一接口的第一部分耦合到至少一个第二接口的第二部分。 第一接口的第二部分耦合到至少一个第三接口的第一部分。 第一接口的第一部分与第一接口的第二部分隔离，第二接口的第一部分与第二接口的第二部分隔离，并且第三接口的第一部分与第二接口的第二部分隔离 的第三个界面。