公开(公告)号：US20170028723A1

公开(公告)日：2017-02-02

申请号：US15114002

申请日：2014-01-30

Applicant: HEWLETT-PACKARD DEVELOPEMENT COMPANY, L.P.

Inventor： Gary G. LUTNESKY ,  Silam J. CHOY

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/155 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1637 ,  B41J2/16535 ,  B41J2002/14491 ,  B41J2202/11 ,  B41J2202/19 ,  B41J2202/20

Abstract: In an example, a fluid injection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity.

Abstract translation: 在一个示例中，流体注入装置包括印刷电路板，其包括导体层，形成印刷电路板的表面的覆盖层和空腔。 打印头芯片可以嵌入在空腔中的模制材料中。