公开(公告)号：US10195852B2

公开(公告)日：2019-02-05

申请号：US15507043

申请日：2014-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J Choy ,  Devin Mourey ,  Eric L Nikkel

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

公开(公告)号：US20170266973A1

公开(公告)日：2017-09-21

申请号：US15507043

申请日：2014-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Silam J Choy ,  Devin Mourey ,  Eric L Nikkel

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B41J2/14024 ,  B41J2/14072 ,  B41J2/1408 ,  B41J2/155 ,  B41J2/1603

Abstract: In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.