公开(公告)号：US20230262933A1

公开(公告)日：2023-08-17

申请号：US18011484

申请日：2020-07-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： HENDRY HUANG ,  KUAN-TING WU ,  CHI HAO CHANG

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20409 ,  H05K7/20454 ,  H05K7/20381

Abstract: The present disclosure describes thermal management devices. In one example, a thermal management device can include a processing unit, a thermal grease layer directly contacting the processing unit, and a heat pipe. The heat pipe can include a heat pipe interior volume having a working fluid disposed therein, a first exterior surface directly contacting the thermal grease layer, a second exterior surface opposite from the first exterior surface, and side exterior surfaces connecting the first exterior surface and the second exterior surface. The thermal management device can also include a device cover spaced from the second exterior surface of the heat pipe by a distance from greater than 1 mm to about 5 mm, and a bracket having a clamping portion that holds the heat pipe by the side exterior surfaces of the heat pipe. The clamping portion does not extend past the first exterior surface of the heat pipe.

公开(公告)号：US20230259179A1

公开(公告)日：2023-08-17

申请号：US18011493

申请日：2020-07-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： CHI HAO CHANG ,  HENDRY HUANG ,  KUAN-TING WU

IPC: G06F1/16 ,  H01Q1/22 ,  H01Q1/40

CPC classification number: G06F1/1698 ,  G06F1/1656 ,  H01Q1/22 ,  H01Q1/40

Abstract: The present disclosure is drawn to housings for electronic devices. In one example, a housing for an electronic device can include a rigid substrate having an exterior surface including a recessed region positioned at an opening extending through the rigid substrate connecting the recessed region to an interior surface of the rigid substrate. A conductive metal antenna is conformally carried by the recessed region and positioned at the opening.

公开(公告)号：US20230171928A1

公开(公告)日：2023-06-01

申请号：US17995876

申请日：2020-04-10

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： CHI HAO CHANG ,  HENDRY HUANG ,  KUAN-TING WU

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  H05K7/20336

Abstract: The present disclosure describes thermal modules having solder-free thermal bonds, methods of forming the thermal modules, and electronic devices that include the thermal modules. In one example, a thermal module having a solder-free thermal bond can include an assembly of a heat pipe and a heat sink mechanically connected to the heat pipe at a bonding junction area. The bonding junction area can include a gap between the heat pipe and the heat sink at a portion of the bonding junction area. A ther-mal coating composition can coat the assembly and fill the gap. The thermal coating composition can include a cured resin and thermally conductive particles.