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公开(公告)号:US20210197257A1
公开(公告)日:2021-07-01
申请号:US16081497
申请日:2017-04-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Vladek KASPERCHIK , Michael G. Monroe , Johnathon HOLROYD
IPC: B22F1/00 , B33Y10/00 , B33Y30/00 , B33Y70/10 , B22F10/10 , B29C64/165 , B33Y40/10 , B29C64/314
Abstract: A metallic build material granule includes a plurality of primary metal particles and a temporary binder agglomerating the plurality of primary metal particles together. The primary metal particles have a primary metal particle size ranging from about the 1 μm to about 20 μm. The primary metal particles are non-shape memory metal particles, and the metallic build material granule excludes shape memory metal particles.
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公开(公告)号:US20220388239A1
公开(公告)日:2022-12-08
申请号:US17891453
申请日:2022-08-19
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling CHAFFINS , Cassady Sparks ROOP , Kevin P. DEKAM , Vladek KASPERCHIK , Ali EMAMJOMEH , Johnathon HOLROYD , Stephen G. RUDISILL , Alexey S. KABALNOV
IPC: B29C64/153 , B29C64/336 , C08L67/04 , B29C70/88 , C08K3/22 , C09D11/40 , C08K3/08 , C09D11/52 , C09D11/322 , B29C64/205 , B33Y30/00 , B33Y50/00 , B33Y40/00 , B33Y80/00 , B29C64/255 , B29C64/227 , B29C64/307 , B29C64/176 , B29C64/182 , B29C64/25 , B33Y40/20 , B29C64/10 , B29C64/20 , B29C64/245 , B29C64/00 , B33Y99/00 , B29C64/30 , B33Y40/10 , B29C64/40
Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.
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