公开(公告)号：US20240081014A1

公开(公告)日：2024-03-07

申请号：US18262152

申请日：2021-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Fu-Yi Chen ,  Jui-Ming Chien

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/1402 ,  H05K7/2039

Abstract: In some examples, a device can include a locking mechanism to couple the device to a computing device enclosure, a first portion at a first level to interact with a processor back-plate, and a second portion at a second level to interact with an area proximate to the processor back-plate, wherein the second portion protrudes to the second level toward the processor back-plate when the device is coupled to the computing device enclosure.

公开(公告)号：US10443778B2

公开(公告)日：2019-10-15

申请号：US15748966

申请日：2015-08-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chern Shi Lam ,  Jui-Ming Chien ,  Hai-Lung Hung ,  Yu Jen Liu ,  Cary Hung

IPC: F16M11/10 ,  F16M11/20 ,  F16M11/42 ,  G06F1/16 ,  G06F1/26

Abstract: An example balancing structure includes a stand and a balancing structure. The stand is to support the object to stand on a plane, and adjust a position of the object. The balancing structure is installed on a base of the stand and is to balance a tipping force of the base suffered from an adjustment of the position of the object.