公开(公告)号：US20220203624A1

公开(公告)日：2022-06-30

申请号：US17604706

申请日：2019-09-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Marc GARCIA GRAU ,  Marta GONZALEZ MALLO ,  Jorge DIOSDADO BORREGO

IPC: B29C64/393 ,  B29C64/245 ,  B33Y50/02 ,  B33Y30/00

Abstract: A build platform of an additive manufacturing apparatus is disclosed. The build platform includes a surface formed of a material having a first emissivity; and a plurality of reference markers disposed on the surface. The reference markers have a second emissivity that is different from the first emissivity. A thermal imaging unit calibration method and additive manufacturing apparatus are also disclosed.

公开(公告)号：US20230032272A1

公开(公告)日：2023-02-02

申请号：US17389229

申请日：2021-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Pol LLOPART MIRAMBELL ,  Marta GONZALEZ MALLO ,  Marc GARCIA GRAU

IPC: B29C64/393 ,  B29C64/165 ,  B22F10/14 ,  B22F10/85 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: A computing device comprising a processor is disclosed herein. The processor is to access print data of a virtual build volume including a plurality of 3D objects to be generated through a selective application of a binder agent by a 3D printer. The processor is further to modify the print data to include a 3D structure at a location within the build volume to protect a 3D object from migrating solvents of the binder agent during a curing operation.