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公开(公告)号：US20200081505A1
公开(公告)日：2020-03-12
申请号：US16469638
申请日：2017-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： XIANG MA , PAUL R LALINDE , BAOSHENG ZHANG , JAMIL A WAKIL
Abstract: In an example, a thermal module may include a conductive cover plate, a fan attached to the conductive cover plate, and a flow channel attached to the conductive cover plate downstream from the fan. The flow channel may direct airflow from the fan to an air outlet of the thermal module. The thermal module may be attachable as a single unit to the electronic device.
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