公开(公告)号：US20200301486A1

公开(公告)日：2020-09-24

申请号：US16649178

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： BAOSHENG ZHANG ,  DEREK KANAS ,  CHAN PARK ,  ANDREW ELSEY

IPC: G06F1/20 ,  G06F1/16 ,  H05K5/02

Abstract: Examples disclosed herein provide a computing device. One example computing device includes a heat generating component disposed within the computing device, and shape memory material (SMM) that adjusts a clearance below a bottom surface of the computing device according to a temperature of the heat generating component.

公开(公告)号：US20200081505A1

公开(公告)日：2020-03-12

申请号：US16469638

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： XIANG MA ,  PAUL R LALINDE ,  BAOSHENG ZHANG ,  JAMIL A WAKIL

IPC: G06F1/20 ,  H05K7/20

Abstract: In an example, a thermal module may include a conductive cover plate, a fan attached to the conductive cover plate, and a flow channel attached to the conductive cover plate downstream from the fan. The flow channel may direct airflow from the fan to an air outlet of the thermal module. The thermal module may be attachable as a single unit to the electronic device.