-
公开(公告)号:US20210291454A1
公开(公告)日:2021-09-23
申请号:US16316154
申请日:2016-09-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Gabriel DE LA CAL , Pablo DOMINGUEZ PASTOR , Pau MARTIN VIDAL , Anna TORRENT , Albert MORA MURCIANO
IPC: B29C64/336 , B29C64/329 , B29C64/393
Abstract: A material management apparatus for an additive manufacturing system comprises a build material supply system to supply build material to a building area for building an object by additive manufacturing. The build material supply system includes a first build material supply unit to supply build material from a first side of a building area and a second build material supply unit to supply build material from a second side of the building area, the second side opposing the first side. The material management apparatus also includes a controller to control the build material supply system to vary an amount of build material to be supplied via the first build material supply unit based on a detected difference between a first amount of material available for supply via the first build material supply unit and a second amount of material available for supply via the second build material supply unit.
-
公开(公告)号:US20180001567A1
公开(公告)日:2018-01-04
申请号:US15542052
申请日:2015-01-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Fernando JUAN , Pau MARTIN VIDAL , Esteve COMAS , Jordi GIMENEZ MANENT , Pol MORRAL , Pablo DOMINGUEZ PASTOR
IPC: B29C64/393 , B29C64/255 , B23K26/342 , B33Y50/02 , B29C64/295 , B33Y30/00 , B29C64/153
CPC classification number: B29C64/393 , B22F3/1055 , B22F2003/1056 , B22F2003/1057 , B23K26/342 , B29C64/153 , B29C64/255 , B29C64/295 , B29C64/386 , B33Y30/00 , B33Y50/02 , Y02P10/295
Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
-
公开(公告)号:US20240165873A1
公开(公告)日:2024-05-23
申请号:US18283792
申请日:2021-03-29
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sergio GONZALEZ MARTIN , Ismael FERNANDEZ AYMERICH , Manuel FREIRE GARCIA , Pablo DOMINGUEZ PASTOR
IPC: B29C64/171 , A46D3/00 , B29C64/393 , B29L31/42 , B33Y10/00 , B33Y50/02 , B33Y80/00
CPC classification number: B29C64/171 , A46D3/00 , B29C64/393 , B33Y10/00 , B33Y50/02 , B33Y80/00 , B29L2031/42
Abstract: Examples include a method implemented in a three dimensional printing system wherein a print job comprising a plurality of parts to be printed is received. A part feature intended to be printed in a specific print mode is identified, wherein the specific print mode is customized for the part feature. The print job is executed using the specific print mode for the part feature. The use of the specific print mode is monitored.
-
公开(公告)号:US20220288861A1
公开(公告)日:2022-09-15
申请号:US17634493
申请日:2019-10-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
IPC: B29C64/393 , B29C64/171 , B33Y50/02
Abstract: Example implementations relate to process capability procedures for additive manufacturing machines. One example implementation receives and prints two objects with corresponding process values for a set of process parameters within two build regions of the build volume. Measurements are made of each object comprising print parameters and a dataset comprising data representing the process values associated with the print parameters and data representing the second process values associated with the second print parameters is generated.
-
公开(公告)号:US20220339884A1
公开(公告)日:2022-10-27
申请号:US17763151
申请日:2019-10-24
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Sergio GONZALEZ MARTIN , Pablo DOMINGUEZ PASTOR , Jordi TORRES BACARDI , Alex CARRUESCO LLORENS
IPC: B29C64/393 , B29C64/153
Abstract: A method (2 analyses (4) a layer of a three-dimensional print job wherein the value of a parameter relating to the processing time of the layer is determined. The method (2) determines (6) whether the layer of the three-dimensional print job is to be printed in a three-dimensional printer. This determination is based on the value of the parameter relating to processing time.
-
公开(公告)号:US20200298482A1
公开(公告)日:2020-09-24
申请号:US16089139
申请日:2016-10-17
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Adrien CHIRON , Yngvar ROSSOW SETHNE , Pablo DOMINGUEZ PASTOR
IPC: B29C64/218 , B29C64/321
Abstract: According to one example there is provided a build material supply system for a 3D printing system. The system comprises a feed tray for containing build material, a plate for removing build material from the feed tray and forming a pile of build material adjacent a spreader of the 3D printing system, and a sensor module to detect build material on the plate.
-
-
-
-
-