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公开(公告)号：US20220080666A1
公开(公告)日：2022-03-17
申请号：US17420503
申请日：2019-05-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Jordi Bautista Ballester , Pablo Dominguez Pastor , Adrien Chiron
IPC: B29C64/364 , B29C64/165 , B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y40/20 , B33Y50/02
Abstract: A three-dimensional printing system comprises a build unit, a three-dimensional printer and a controller. The build unit comprising a build chamber and a heater. The printer is configured to generate a build volume comprising a three-dimensional object within the build chamber and the heater is configured to heat the build chamber. The controller is configured to control the heater to heat the build chamber for a predetermined time period after the build volume is generated, to allow the object to crystallise.
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公开(公告)号：US20230060712A1
公开(公告)日：2023-03-02
申请号：US17758092
申请日：2020-01-31
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Pol Fornos Martinez , Xavier Espert Canet , Ismael Fernandez Aymerich , Roger Fadurdo Orellana , Pol llopat Mirambell , Marc Borras Camarasa , Alejandro Manuel de Pena Hempel , Pablo Dominguez Pastor
IPC: B29C64/393 , B29C64/165
Abstract: A 3D printer is controlled to apply a print agent at a plurality of predetermined locations in a build chamber of the 3D printer, and energy is applied to heat the build chamber. A thermal image of the build chamber is received. Based on the thermal image, an error in application of the print agent in the build chamber is determined.
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公开(公告)号：US11072027B2
公开(公告)日：2021-07-27
申请号：US15542052
申请日：2015-01-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Fernando Juan , Pau Martin Vidal , Esteve Comas , Jordi Gimenez Manent , Pol Morral , Pablo Dominguez Pastor
IPC: B22F12/00 , B29C64/259 , B33Y30/00 , B33Y50/02 , B23K26/342 , B29C64/255 , B29C64/295 , B29C64/393 , B22F10/10 , B29C64/153
Abstract: A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
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公开(公告)号：US20180264728A1
公开(公告)日：2018-09-20
申请号：US15745612
申请日：2015-11-23
Applicant: Jose Manuel GRASES , Pau MARTIN VIDAL , Fernando JUAN , Pablo DOMINGUEZ PASTOR , Gerard MOSQUERA , HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Jose Manuel Grases , Pau Martin Vidal , Fernando Juan , Pablo Dominguez Pastor , Gerard Mosquera
IPC: B29C64/329 , B29C64/218 , B29C64/153 , B29C64/393
Abstract: According to one example there is provided an apparatus for supplying build material to a three-dimensional printing system. The apparatus comprises a rotatable vane.
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公开(公告)号：US11590709B2
公开(公告)日：2023-02-28
申请号：US16069509
申请日：2016-03-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Xavier Vilajosana , Sebastia Cortes i Herms , David Ramirez Muela , Pablo Dominguez Pastor , Alejandro Manuel De Pena
IPC: B29C64/393 , B33Y30/00 , B33Y50/02 , B33Y10/00 , B29C64/153 , B29C64/20 , B33Y50/00 , B29C64/165 , B29C64/188
Abstract: Examples include apparatuses, processes, and methods for generating three-dimensional objects. An example apparatus comprises build material distributor and a controller. Examples distribute a particular build layer in a build area of the apparatus over a previous build layer. Examples determine a build layer temperature corresponding to the particular build layer. Examples analyze build layer coverage for the particular build layer based at least in part on a build layer temperature of the previous build layer and the build layer temperature of the particular build layer. Examples selectively recoat the particular build layer with additional build material based at least in part on the build layer coverage for the particular build layer.
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Patent Agency Ranking
公开(公告)号：US10596760B2
公开(公告)日：2020-03-24
申请号：US15745612
申请日：2015-11-23
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Jose Manuel Grases , Pau Martin Vidal , Fernando Juan , Pablo Dominguez Pastor , Gerard Mosquera
IPC: B29C64/329 , B29C64/153 , B29C64/20 , B29C64/393 , B29C64/218 , B33Y30/00 , B33Y10/00 , B33Y40/00 , B33Y50/02 , B29C64/205
Abstract: According to one example there is provided an apparatus for supplying build material to a three-dimensional printing system. The apparatus comprises a rotatable vane.
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公开(公告)号：US20200086575A1
公开(公告)日：2020-03-19
申请号：US16690378
申请日：2019-11-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Jose Manuel Grases , Pau Martin Vidal , Fernando Juan , Pablo Dominguez Pastor , Gerard Mosquera
IPC: B29C64/329 , B29C64/218 , B29C64/393 , B29C64/153 , B29C64/20 , B29C64/205
Abstract: According to one example there is provided an apparatus for supplying build material to a three-dimensional printing system. The apparatus comprises a rotatable vane.
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公开(公告)号：US20190022950A1
公开(公告)日：2019-01-24
申请号：US16069509
申请日：2016-03-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Xavier Vilajosana , Sebastia Cortes i Herms , David Ramirez Muela , Pablo Dominguez Pastor , Alejandro Manuel De Pena
IPC: B29C64/393 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C64/153 , B29C64/20
Abstract: Examples include apparatuses, processes, and methods for generating three-dimensional objects. An example apparatus comprises build material distributor and a controller. Examples distribute a particular build layer in a build area of the apparatus over a previous build layer. Examples determine a build layer temperature corresponding to the particular build layer. Examples analyze build layer coverage for the particular build layer based at least in part on a build layer temperature of the previous build layer and the build layer temperature of the particular build layer. Examples selectively recoat the particular build layer with additional build material based at least in part on the build layer coverage for the particular build layer.
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公开(公告)号：US12194685B2
公开(公告)日：2025-01-14
申请号：US17634493
申请日：2019-10-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
IPC: B29C64/393 , B29C64/171 , B33Y50/02 , B33Y30/00
Abstract: Example implementations relate to process capability procedures for additive manufacturing machines. One example implementation receives and prints two objects with corresponding process values for a set of process parameters within two build regions of the build volume. Measurements are made of each object comprising print parameters and a dataset comprising data representing the process values associated with the print parameters and data representing the second process values associated with the second print parameters is generated.
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公开(公告)号：US12049045B2
公开(公告)日：2024-07-30
申请号：US18086997
申请日：2022-12-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Xavier Vilajosana , Sebastia Cortes i Herms , David Ramirez Muela , Pablo Dominguez Pastor , Alejandro Manuel de Pena
IPC: B29C64/393 , B29C64/153 , B29C64/165 , B29C64/188 , B29C64/20 , B33Y10/00 , B33Y30/00 , B33Y50/00 , B33Y50/02
CPC classification number: B29C64/393 , B29C64/153 , B29C64/165 , B29C64/188 , B29C64/20 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y50/00
Abstract: Examples include apparatuses, processes, and methods for generating three-dimensional objects. An example apparatus comprises build material distributor and a controller. Examples distribute a particular build layer in a build area of the apparatus over a previous build layer. Examples determine a build layer temperature corresponding to the particular build layer. Examples analyze build layer coverage for the particular build layer based at least in part on a build layer temperature of the previous build layer and the build layer temperature of the particular build layer. Examples selectively recoat the particular build layer with additional build material based at least in part on the build layer coverage for the particular build layer.
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