公开(公告)号：US20220403528A1

公开(公告)日：2022-12-22

申请号：US17777745

申请日：2019-12-09

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： KUAN-TING WU ,  CHI HAO CHANG ,  QINGYONG GUO

IPC: C23C28/00 ,  C23C22/48 ,  C23C22/78 ,  C25D11/30 ,  C25D11/02 ,  C25D13/12 ,  C25D13/20 ,  C25D13/22 ,  C09D5/44 ,  C09D5/02 ,  C09D133/04 ,  C09D7/20 ,  H05K5/04 ,  G06F1/16

Abstract: A coated metal alloy substrate for an electronic device, a process for producing a coated metal alloy substrate for an electronic device and a housing for an electronic device, comprising a coated metal alloy substrate wherein the coated metal alloy CA substrate comprises at least one chamfered edge (1) and comprises: a passivation layer (2) deposited on the at least one chamfered edge (1); an electrophoretic deposition layer (3) deposited on the passivation layer (2); and a hydrophobic layer (4) deposited on the electrophoretic deposition layer (3).