公开(公告)号：US09753506B2

公开(公告)日：2017-09-05

申请号：US14622433

申请日：2015-02-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Shaheen Saroor ,  Robert C. Brooks ,  Kent E. Biggs ,  Robin T. Castell

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1632

Abstract: In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.

公开(公告)号：US20140298411A1

公开(公告)日：2014-10-02

申请号：US13850883

申请日：2013-03-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robin T. Castell ,  Timothy Neill ,  Donald Gonzalez

IPC: H04W12/08

CPC classification number: H04W12/08 ,  H04W4/80

Abstract: One example provides a system including a Near Field Communication (NFC) module including a secure element and a host computer communicatively coupled to the NFC module. The host computer includes a manageability engine. A secure NFC application of the host computer is to access the secure element through the manageability engine.

Abstract translation: 一个示例提供了一种包括包括安全元件的近场通信（NFC）模块和通信地耦合到NFC模块的主机的系统。 主机包括可管理引擎。 主机的安全NFC应用程序是通过可管理性引擎来访问安全元件。

公开(公告)号：US20160239056A1

公开(公告)日：2016-08-18

申请号：US14622433

申请日：2015-02-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Shaheen Saroor ,  Robert C. Brooks ,  Kent E. Biggs ,  Robin T. Castell

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1632

Abstract: In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.

Abstract translation: 在根据本公开的一个示例中，描述了具有多层减热部件的电子设备。 该装置包括多个集成电路和与多个集成电路中的至少一个接触的第一层，以从至少一个集成电路去除热量。 该装置还包括通过气隙与第一层隔开的第二层，以减少第一层和第二层之间的热传递。 第二层是可缩回的，以便在停靠在车站时露出第一层。 电子设备在停靠在车站时处于第一模式，而当不与车站对接时工作在第二模式。