Computing Devices
    1.
    发明申请

    公开(公告)号:US20220197360A1

    公开(公告)日:2022-06-23

    申请号:US17606089

    申请日:2019-07-31

    Abstract: A computing device is disclosed. The computing device includes a processing device having a rating of a first power amount. The computing device includes a processing infrastructure coupled to the processing device. The processing infrastructure is configured for a second power amount in which the second power amount is greater than the first power amount. The processing device is configurable to operate at the first power amount and the second power amount.

    BOARD TO BOARD CONNECTORS
    2.
    发明申请

    公开(公告)号:US20220149552A1

    公开(公告)日:2022-05-12

    申请号:US17419806

    申请日:2019-07-31

    Abstract: A board to board connector includes a first male connector and a second male connector. The first male connector includes a first number of pins. The second male connector is aligned with the first male connector and includes a second number of pins. The first male connector is configured to be removably electrically coupled to a first female connector including a third number of pins equal to the first number and the second male connector is configured to be removably electrically coupled to a second female connector including a fourth number of pins equal to the second number. The first male connector and the second male connector are also configured to be removably electrically coupled to a single third female connector including a fifth number of pins equal to the first number plus the second number.

    Board to board connectors
    5.
    发明授权

    公开(公告)号:US12027791B2

    公开(公告)日:2024-07-02

    申请号:US17419806

    申请日:2019-07-31

    CPC classification number: H01R12/728 H01R12/73

    Abstract: A board to board connector includes a first male connector and a second male connector. The first male connector includes a first number of pins. The second male connector is aligned with the first male connector and includes a second number of pins. The first male connector is configured to be removably electrically coupled to a first female connector including a third number of pins equal to the first number and the second male connector is configured to be removably electrically coupled to a second female connector including a fourth number of pins equal to the second number. The first male connector and the second male connector are also configured to be removably electrically coupled to a single third female connector including a fifth number of pins equal to the first number plus the second number.

    Power limit alterations of component types

    公开(公告)号:US11307629B2

    公开(公告)日:2022-04-19

    申请号:US17048392

    申请日:2018-07-31

    Abstract: In some examples, a non-transitory machine-readable medium can include instructions executable by a processing resource to: monitor system power for a computing system that includes a first computing component type and a second computing component type, determine a power event type for the computing system based on the monitored system power, and alter a power limit of the second computing component type by a predetermined increment based on the power event type while maintaining a power limit of the first computing component type when the second computing component type is a sub-system of the computing system.

    CHARGING MODULES
    7.
    发明申请
    CHARGING MODULES 审中-公开

    公开(公告)号:US20190052129A1

    公开(公告)日:2019-02-14

    申请号:US15759071

    申请日:2015-09-29

    Abstract: Examples disclosed herein provide a computing device to charge a rechargeable device. An example computing device can include a module with an enclosure to accommodate the rechargeable device. The computing device can include a transmitter within the module to wirelessly charge the rechargeable device via a receiver disposed within the rechargeable device. The computing device can include a display surface to replicate content illustrated on a screen of the rechargeable device, when the rechargeable device is to be disposed within the enclosure.

    ELECTRONIC DEVICES WITH MULTI-LAYER HEAT REDUCTION COMPONENTS
    8.
    发明申请
    ELECTRONIC DEVICES WITH MULTI-LAYER HEAT REDUCTION COMPONENTS 有权
    具有多层减热组件的电子设备

    公开(公告)号:US20160239056A1

    公开(公告)日:2016-08-18

    申请号:US14622433

    申请日:2015-02-13

    CPC classification number: G06F1/203 G06F1/1632

    Abstract: In one example in accordance with the present disclosure an electronic device with a multi-layer heat reduction component is described. The device includes a number of integrated circuits and a first layer in contact with at least one of the number of integrated circuits to remove heat from at least one integrated circuit. The device also includes a second layer separated from the first layer by an air gap to reduce heat transfer between the first layer and the second layer. The second layer is retractable to expose the first layer when docked to a station. The electronic device operates in a first mode when docked to a station and a second mode when not docked to the station.

    Abstract translation: 在根据本公开的一个示例中,描述了具有多层减热部件的电子设备。 该装置包括多个集成电路和与多个集成电路中的至少一个接触的第一层,以从至少一个集成电路去除热量。 该装置还包括通过气隙与第一层隔开的第二层,以减少第一层和第二层之间的热传递。 第二层是可缩回的,以便在停靠在车站时露出第一层。 电子设备在停靠在车站时处于第一模式,而当不与车站对接时工作在第二模式。

    POWER LIMIT ALTERATIONS OF COMPONENT TYPES

    公开(公告)号:US20220221923A1

    公开(公告)日:2022-07-14

    申请号:US17706970

    申请日:2022-03-29

    Abstract: In some examples, a non-transitory machine-readable medium can include instructions executable by a processing resource to: monitor system power for a computing system that includes a first computing component type and a second computing component type, determine a power event type for the computing system based on the monitored system power, and alter a power limit of the second computing component type by a predetermined increment based on the power event type while maintaining a power limit of the first computing component type when the second computing component type is a sub-system of the computing system.

    Thermal modules for electronic devices

    公开(公告)号:US11310936B2

    公开(公告)日:2022-04-19

    申请号:US17048116

    申请日:2018-05-31

    Abstract: Example thermal modules are disclosed. An example thermal module for use with an electronic device includes a first heatsink defining a first airflow exit. The first heatsink including a first set of fins having a first height and a second set of fins having a second height. The second height being less than the first height. The second set of fins being adjacent the first airflow exit. A second heatsink defines a second airflow exit. The second heatsink is spaced from the first heatsink to form a gap therebetween. The second heatsink is thermally coupled to the first heatsink via a heat pipe.

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