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公开(公告)号：US20210031192A1
公开(公告)日：2021-02-04
申请号：US16768857
申请日：2018-03-12
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Pavel Kornilovich , Ross Warner , Alexander Govyadinov
IPC: B01L3/00
Abstract: A microfluidic device may include a die package. The die package may include at least on fluidic die and an overmold material overmolding the fluidic die. The microfluidic device may also include a mesofluidic plate coupled to the die package. The mesofluidic plate includes at least one mesofluidic channel formed therein to fluidically couple the fluidic die.
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